Inventor
KOIKE NOBUYA
JP31 patents
⚠️ This page may combine multiple inventors who share the name “KOIKE NOBUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS ELECTRONICS CORP
12 patentsUS8367479B2Feb 5, 2013
Semiconductor device and manufacturing method thereof
RENESAS ELECTRONICS CORP13 citations84
US8362626B2Jan 29, 2013
Semiconductor device with non-overlapped circuits
RENESAS ELECTRONICS CORP9 citations84
US9704979B2Jul 11, 2017
Semiconductor device and an electronic device
RENESAS ELECTRONICS CORP9 citations80
US10031164B2Jul 24, 2018
Semiconductor device
RENESAS ELECTRONICS CORP6 citations72
US9997620B2Jun 12, 2018
Semiconductor device and an electronic device
RENESAS ELECTRONICS CORP2 citations69
US8975733B2Mar 10, 2015
Semiconductor device and a manufacturing method thereof
RENESAS ELECTRONICS CORP3 citations63
US7968370B2Jun 28, 2011
Semiconductor connection component
RENESAS ELECTRONICS CORP2 citations62
US9396971B2Jul 19, 2016
Semiconductor device and a manufacturing method thereof
RENESAS ELECTRONICS CORP0 citations52
US9230831B2Jan 5, 2016
Semiconductor device and a manufacturing method thereof
RENESAS ELECTRONICS CORP0 citations52
US8026130B2Sep 27, 2011
Method for manufacturing a semiconductor integrated circuit device
RENESAS ELECTRONICS CORP0 citations52
US8564112B2Oct 22, 2013
Semiconductor device
RENESAS ELECTRONICS CORP0 citations51
US10453946B2Oct 22, 2019
Semiconductor device and an electronic device
RENESAS ELECTRONICS CORP0 citations48
HITACHI LTD
8 patentsUS6434008B1Aug 13, 2002
Semiconductor device
HITACHI LTD84 citations97
US5956231ASep 21, 1999
Semiconductor device having power semiconductor elements
HITACHI LTD85 citations96
US5808359ASep 15, 1998
Semiconductor device having a heat sink with bumpers for protecting outer leads
HITACHI LTD40 citations95
US5621243AApr 15, 1997
Semiconductor device having thermal stress resistance structure
HITACHI LTD80 citations95
US6492739B2Dec 10, 2002
Semiconductor device having bumper portions integral with a heat sink
HITACHI LTD12 citations81
US6392308B2May 21, 2002
Semiconductor device having bumper portions integral with a heat sink
HITACHI LTD4 citations73
US6320270B1Nov 20, 2001
Semiconductor device and method of producing the same
HITACHI LTD7 citations73
US6104085AAug 15, 2000
Semiconductor device and method of producing the same
HITACHI LTD9 citations73