Inventor
HUANG LIHUA LI
US6 patents
⚠️ This page may combine multiple inventors who share the name “HUANG LIHUA LI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
4 patentsUS7132369B2Nov 7, 2006
Method of forming a low-K dual damascene interconnect structure
APPLIED MATERIALS INC27 citations92
US7422776B2Sep 9, 2008
Low temperature process to produce low-K dielectrics with low stress by plasma-enhanced chemical vapor deposition (PECVD)
APPLIED MATERIALS INC33 citations91
US7435685B2Oct 14, 2008
Method of forming a low-K dual damascene interconnect structure
APPLIED MATERIALS INC13 citations83
US7459404B2Dec 2, 2008
Adhesion improvement for low k dielectrics
APPLIED MATERIALS INC2 citations60