P

Inventor

CHIU SHIH-CHAO

TW15 patents
⚠️ This page may combine multiple inventors who share the name “CHIU SHIH-CHAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SILICONWARE PRECISION INDUSTRIES CO LTD

13 patents
US9490225B2Nov 8, 2016

Package structure and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD2 citations61
US10141266B2Nov 27, 2018

Method of fabricating semiconductor package structure

SILICONWARE PRECISION INDUSTRIES CO LTD1 citations51
US10068842B2Sep 4, 2018

Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US10043757B2Aug 7, 2018

Semiconductor package structure and method of fabricating the same

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US10002825B2Jun 19, 2018

Method of fabricating package structure with an embedded electronic component

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9905438B2Feb 27, 2018

Method of manufacturing package substrate and semiconductor package

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9899249B2Feb 20, 2018

Fabrication method of coreless packaging substrate

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9735080B2Aug 15, 2017

Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9716060B2Jul 25, 2017

Package structure with an embedded electronic component and method of fabricating the package structure

SILICONWARE PRECISION INDUSTRIES CO LTD1 citations51
US9673140B2Jun 6, 2017

Package structure having a laminated release layer and method for fabricating the same

SILICONWARE PRECISION INDUSTRIES CO LTD1 citations51
US9640503B2May 2, 2017

Package substrate, semiconductor package and method of manufacturing the same

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9510463B2Nov 29, 2016

Coreless packaging substrate and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9082723B2Jul 14, 2015

Semiconductor package and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD1 citations51

MEDIATEK INC

2 patents
US12080614B2Sep 3, 2024

Lidded semiconductor package

MEDIATEK INC0 citations60
US12388194B2Aug 12, 2025

Antenna-in-module package-on-package with air trenches

MEDIATEK INC0 citations58