Inventor
XU DINGYING DAVID
US6 patents
Patents
6 patentsUS11676891B2Jun 13, 2023
Method to enable 30 microns pitch EMIB or below
INTEL CORP2 citations70
US11088062B2Aug 10, 2021
Method to enable 30 microns pitch EMIB or below
INTEL CORP4 citations70
US10168357B2Jan 1, 2019
Coated probe tips for plunger pins of an integrated circuit package test system
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US12494441B2Dec 9, 2025
BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling load
INTEL CORP0 citations59
US12230563B2Feb 18, 2025
Method to enable 30 microns pitch EMIB or below
INTEL CORP0 citations59
US9659889B2May 23, 2017
Solder-on-die using water-soluble resist system and method
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