Inventor
CHAFFINS STERLING
US44 patents
⚠️ This page may combine multiple inventors who share the name “CHAFFINS STERLING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
36 patentsUS10375765B2Aug 6, 2019
3-dimensional printed load cell parts
HEWLETT PACKARD DEVELOPMENT CO15 citations93
US10926464B2Feb 23, 2021
Material sets
HEWLETT PACKARD DEVELOPMENT CO7 citations83
US7569331B2Aug 4, 2009
Conductive patterning
HEWLETT PACKARD DEVELOPMENT CO13 citations82
US11911825B2Feb 27, 2024
Fusing electronic components into three-dimensional objects via additive manufacturing processes
HEWLETT PACKARD DEVELOPMENT CO3 citations75
US11199456B2Dec 14, 2021
Temperature sensors
HEWLETT PACKARD DEVELOPMENT CO5 citations73
US11001000B2May 11, 2021
Three-dimensional (3D) printing
HEWLETT PACKARD DEVELOPMENT CO3 citations72
US10047233B2Aug 14, 2018
Magenta inks
HEWLETT PACKARD DEVELOPMENT CO4 citations72
US10040959B2Aug 7, 2018
Pigment-based inkjet inks
HEWLETT PACKARD DEVELOPMENT CO2 citations72
US11090862B2Aug 17, 2021
Strain sensors
HEWLETT PACKARD DEVELOPMENT CO4 citations71
US11064572B2Jul 13, 2021
3-dimensional printed heater
HEWLETT PACKARD DEVELOPMENT CO2 citations71
US11001050B2May 11, 2021
Material sets
HEWLETT PACKARD DEVELOPMENT CO3 citations66
US11760010B2Sep 19, 2023
Forming three-dimensional (3D) electronic parts
HEWLETT PACKARD DEVELOPMENT CO1 citations62
US11312877B2Apr 26, 2022
Pretreat compositions
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US10294381B2May 21, 2019
Pigment-based inkjet inks
HEWLETT PACKARD DEVELOPMENT CO1 citations62
US7498117B2Mar 3, 2009
System and method for radiation imaging by in-situ particle formation
HEWLETT PACKARD DEVELOPMENT CO4 citations62
US12214549B2Feb 4, 2025
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US12042986B2Jul 23, 2024
3-dimensional printed parts
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US12011874B2Jun 18, 2024
Strain sensors
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US11981075B2May 14, 2024
3-dimensional printed parts
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US11712845B2Aug 1, 2023
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO1 citations61
US11465341B2Oct 11, 2022
3-dimensional printed parts
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US11458675B2Oct 4, 2022
Material sets
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US11426932B2Aug 30, 2022
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US11427725B2Aug 30, 2022
Photoluminescent material sets
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US7733016B2Jun 8, 2010
Defining electrode regions of electroluminescent panel
HEWLETT PACKARD DEVELOPMENT CO2 citations61
US11292189B2Apr 5, 2022
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations59
US11304313B2Apr 12, 2022
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations58
US11738508B2Aug 29, 2023
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations56
US11642842B2May 9, 2023
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO1 citations56
US11167482B2Nov 9, 2021
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations56
US10654268B2May 19, 2020
Modifying firing parameters for printheads
HEWLETT PACKARD DEVELOPMENT CO0 citations49
US10183488B2Jan 22, 2019
Printer fluid impedance sensing in a printhead
HEWLETT PACKARD DEVELOPMENT CO0 citations49
US11795338B2Oct 24, 2023
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations48
US10294382B2May 21, 2019
Magenta inks
HEWLETT PACKARD DEVELOPMENT CO0 citations48
US12138860B2Nov 12, 2024
Three-dimensional printing conductive elements
HEWLETT PACKARD DEVELOPMENT CO0 citations47
US7576199B2Aug 18, 2009
Near infrared dyes
HEWLETT PACKARD DEVELOPMENT CO0 citations42