Inventor

WENG LI-SHENG

US19 patents

⚠️ This page may combine multiple inventors who share the name “WENG LI-SHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WENG LI-SHENG

QUALCOMM INC

Multi-die interconnect

Repurposed seed layer for high frequency noise control and electrostatic discharge connection

Package comprising a substrate having a via wall configured as a shield

Package comprising a substrate and a high-density interconnect integrated device coupled to the substrate

Package comprising wire bonds coupled to integrated devices

Integrated device comprising interconnect structures having an inner interconnect, a dielectric layer and a conductive layer

Package comprising integrated devices coupled through a metallization layer

Package comprising a substrate and a high-density interconnect integrated device

INTEL CORP

Conductive coating for a microelectronics package

Conductive coating for a microelectronics package

Microelectronic package having electromagnetic interference shielding

Integrated circuit package including floating package stiffener

Solder resist layer structures for terminating de-featured components and methods of making the same

Solder resist layer structures for terminating de-featured components and methods of making the same

XILINX INC

Chip package with near-die integrated passive device

Chip package with core embedded integrated devices

Coupled loop and void structure integrated in a redistribution layer of a chip package

Chip package with core embedded integrated passive device

Chip package with integrated current control