Inventor
HWANG SUHYUNG
US20 patents
Patents
20 patentsUS11239573B2Feb 1, 2022
Sub-module L-shaped millimeter wave antenna-in-package
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US11183446B1Nov 23, 2021
X.5 layer substrate
QUALCOMM INC4 citations72
US12125742B2Oct 22, 2024
Package comprising a substrate with high density interconnects
QUALCOMM INC2 citations71
US11696390B2Jul 4, 2023
Systems for shielding bent signal lines
QUALCOMM INC3 citations69
US11495873B2Nov 8, 2022
Device comprising multi-directional antennas in substrates coupled through flexible interconnects
QUALCOMM INC5 citations69
US11764489B2Sep 19, 2023
Sub-module L-shaped millimeter wave antenna-in-package
QUALCOMM INC0 citations62
US11545425B2Jan 3, 2023
Substrate comprising interconnects embedded in a solder resist layer
QUALCOMM INC1 citations62
US11258165B2Feb 22, 2022
Asymmetric antenna structure
QUALCOMM INC0 citations62
US11043740B2Jun 22, 2021
Enhanced antenna module with shield layer
QUALCOMM INC0 citations62
US12126071B2Oct 22, 2024
Multi-directional antenna modules employing a surface-mount antenna(s) to support antenna pattern multi-directionality, and related fabrication methods
QUALCOMM INC1 citations61
US11869833B2Jan 9, 2024
Package comprising a substrate with a via interconnect coupled to a trace interconnect and method of fabricating the same
QUALCOMM INC0 citations61
US11735804B2Aug 22, 2023
Multi-core broadband PCB antenna
QUALCOMM INC0 citations61
US11399435B2Jul 26, 2022
Device comprising multi-directional antennas coupled through a flexible printed circuit board
QUALCOMM INC0 citations61
US11139224B2Oct 5, 2021
Package comprising a substrate having a via wall configured as a shield
QUALCOMM INC0 citations61
US11439008B2Sep 6, 2022
Package with substrate comprising variable thickness solder resist layer
QUALCOMM INC1 citations57
US12300873B2May 13, 2025
Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods
QUALCOMM INC0 citations51
US12293980B2May 6, 2025
Package comprising discrete antenna device
QUALCOMM INC0 citations51
US11823983B2Nov 21, 2023
Package with a substrate comprising pad-on-pad interconnects
QUALCOMM INC0 citations51
US11551939B2Jan 10, 2023
Substrate comprising interconnects embedded in a solder resist layer
QUALCOMM INC0 citations51
US12593705B2Mar 31, 2026
Hybrid core substrate with embedded components
QUALCOMM INC0 citations46