Inventor
YEON JAEHYUN
US22 patents
Patents
22 patentsUS11239573B2Feb 1, 2022
Sub-module L-shaped millimeter wave antenna-in-package
QUALCOMM INC3 citations72
US11183446B1Nov 23, 2021
X.5 layer substrate
QUALCOMM INC4 citations72
US12125742B2Oct 22, 2024
Package comprising a substrate with high density interconnects
QUALCOMM INC2 citations71
US11495873B2Nov 8, 2022
Device comprising multi-directional antennas in substrates coupled through flexible interconnects
QUALCOMM INC5 citations69
US11764489B2Sep 19, 2023
Sub-module L-shaped millimeter wave antenna-in-package
QUALCOMM INC0 citations62
US11637057B2Apr 25, 2023
Uniform via pad structure having covered traces between partially covered pads
QUALCOMM INC0 citations62
US11545425B2Jan 3, 2023
Substrate comprising interconnects embedded in a solder resist layer
QUALCOMM INC1 citations62
US11258165B2Feb 22, 2022
Asymmetric antenna structure
QUALCOMM INC0 citations62
US11101220B2Aug 24, 2021
Through-package partial via on package edge
QUALCOMM INC0 citations62
US11075260B2Jul 27, 2021
Substrate comprising recessed interconnects and a surface mounted passive component
QUALCOMM INC0 citations62
US11043740B2Jun 22, 2021
Enhanced antenna module with shield layer
QUALCOMM INC0 citations62
US12126071B2Oct 22, 2024
Multi-directional antenna modules employing a surface-mount antenna(s) to support antenna pattern multi-directionality, and related fabrication methods
QUALCOMM INC1 citations61
US11869833B2Jan 9, 2024
Package comprising a substrate with a via interconnect coupled to a trace interconnect and method of fabricating the same
QUALCOMM INC0 citations61
US11735804B2Aug 22, 2023
Multi-core broadband PCB antenna
QUALCOMM INC0 citations61
US11399435B2Jul 26, 2022
Device comprising multi-directional antennas coupled through a flexible printed circuit board
QUALCOMM INC0 citations61
US11139224B2Oct 5, 2021
Package comprising a substrate having a via wall configured as a shield
QUALCOMM INC0 citations61
US11439008B2Sep 6, 2022
Package with substrate comprising variable thickness solder resist layer
QUALCOMM INC1 citations57
US12300873B2May 13, 2025
Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods
QUALCOMM INC0 citations51
US12293980B2May 6, 2025
Package comprising discrete antenna device
QUALCOMM INC0 citations51
US11823983B2Nov 21, 2023
Package with a substrate comprising pad-on-pad interconnects
QUALCOMM INC0 citations51
US11551939B2Jan 10, 2023
Substrate comprising interconnects embedded in a solder resist layer
QUALCOMM INC0 citations51
US12593705B2Mar 31, 2026
Hybrid core substrate with embedded components
QUALCOMM INC0 citations46