Inventor

MA BO-HAO

TW6 patents

Patents

6 patents

US11315881B1Apr 26, 2022

Electronic package and manufacturing method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD7 citations83

US10741500B2Aug 11, 2020

Electronic package

SILICONWARE PRECISION INDUSTRIES CO LTD3 citations70

US11195812B2Dec 7, 2021

Method for fabricating an encapsulated electronic package using a supporting plate

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations60

US11289346B2Mar 29, 2022

Method for fabricating electronic package

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59

US12125828B2Oct 22, 2024

Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the same

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations55

US11923337B2Mar 5, 2024

Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the same

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations55