Inventor
LEE TZUNG-HUI
TW19 patents
Patents
19 patentsUS10510646B2Dec 17, 2019
Packae structure, RDL structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11410918B2Aug 9, 2022
Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a carrier
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10861814B2Dec 8, 2020
Integrated fan-out packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US10297560B2May 21, 2019
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11289373B2Mar 29, 2022
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10461023B2Oct 29, 2019
Semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations70
US9871009B2Jan 16, 2018
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12094830B2Sep 17, 2024
Integrated fan-out (InFO) package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11855014B2Dec 26, 2023
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11842955B2Dec 12, 2023
Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a redistribution structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11393763B2Jul 19, 2022
Integrated fan-out (info) package structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11289410B2Mar 29, 2022
Integrated circuit packages and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11217518B2Jan 4, 2022
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10867793B2Dec 15, 2020
Semiconductor package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11848233B2Dec 19, 2023
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11398416B2Jul 26, 2022
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10867941B2Dec 15, 2020
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10074623B2Sep 11, 2018
Method of fabricating redistribution circuit structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51
US9899342B2Feb 20, 2018
Integrated fan-out package, redistribution circuit structure, and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51