Inventor
CHAN MEI-LIN
US16 patents
⚠️ This page may combine multiple inventors who share the name “CHAN MEI-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INVENSENSE INC
13 patentsUS9809451B2Nov 7, 2017
Capacitive sensing structure with embedded acoustic channels
INVENSENSE INC2 citations73
US9344808B2May 17, 2016
Differential sensing acoustic sensor
INVENSENSE INC3 citations72
US11460957B2Oct 4, 2022
Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
INVENSENSE INC3 citations71
US9802815B2Oct 31, 2017
Method for MEMS structure with dual-level structural layer and acoustic port
INVENSENSE INC4 citations70
US11216632B2Jan 4, 2022
Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
INVENSENSE INC2 citations68
US11176345B2Nov 16, 2021
Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
INVENSENSE INC2 citations68
US9216897B2Dec 22, 2015
Capacitive sensing structure with embedded acoustic channels
INVENSENSE INC3 citations62
US11682228B2Jun 20, 2023
Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
INVENSENSE INC0 citations57
US11515465B2Nov 29, 2022
EMI reduction in piezoelectric micromachined ultrasound transducer array
INVENSENSE INC1 citations57
US11517938B2Dec 6, 2022
Reflection minimization for sensor
INVENSENSE INC0 citations51
US11188735B2Nov 30, 2021
Fake finger detection using ridge features
INVENSENSE INC0 citations50
US11623246B2Apr 11, 2023
Piezoelectric micromachined ultrasound transducer device with piezoelectric barrier layer
INVENSENSE INC0 citations49
US9227842B2Jan 5, 2016
Method for MEMS structure with dual-level structural layer and acoustic port
INVENSENSE INC0 citations49