Inventor
NAIR DEEPUKUMAR M
US14 patents
⚠️ This page may combine multiple inventors who share the name “NAIR DEEPUKUMAR M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QORVO US INC
6 patentsUS11114363B2Sep 7, 2021
Electronic package arrangements and related methods
QORVO US INC3 citations70
US11551995B2Jan 10, 2023
Substrate with embedded active thermoelectric cooler
QORVO US INC2 citations68
US10587029B2Mar 10, 2020
Multi-layer substrate with integrated resonator
QORVO US INC2 citations65
US12327679B2Jun 10, 2025
Process for making laminate substrate with sintered components
QORVO US INC0 citations60
US11783998B2Oct 10, 2023
Process for making laminate substrate with sintered components
QORVO US INC0 citations60
US10906274B2Feb 2, 2021
Laminate substrate with sintered components
QORVO US INC0 citations60
DELPHI TECH INC
2 patentsDU PONT
2 patentsUS9153863B2Oct 6, 2015
Low temperature co-fired ceramic (LTCC) system in a package (SiP) configurations for microwave/millimeter wave packaging applications
DU PONT35 citations88
US9579748B2Feb 28, 2017
Method of fabricating electromagnetic bandgap (EBG) structures for microwave/millimeterwave applications using laser processing of unfired low temperature co-fired ceramic (LTCC) tape
DU PONT3 citations69