Inventor
RAILKAR TARAK A
US30 patents
⚠️ This page may combine multiple inventors who share the name “RAILKAR TARAK A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QORVO US INC
14 patentsUS11626340B2Apr 11, 2023
Integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL)
QORVO US INC9 citations83
US10390434B2Aug 20, 2019
Laminate-based package with internal overmold
QORVO US INC3 citations71
US9991181B2Jun 5, 2018
Air-cavity package with enhanced package integration level and thermal performance
QORVO US INC2 citations71
US9974158B2May 15, 2018
Air-cavity package with two heat dissipation interfaces
QORVO US INC5 citations71
US11551995B2Jan 10, 2023
Substrate with embedded active thermoelectric cooler
QORVO US INC2 citations68
US9799637B2Oct 24, 2017
Semiconductor package with lid having lid conductive structure
QORVO US INC2 citations66
US10587029B2Mar 10, 2020
Multi-layer substrate with integrated resonator
QORVO US INC2 citations65
US10177064B2Jan 8, 2019
Air cavity package
QORVO US INC1 citations62
US12327679B2Jun 10, 2025
Process for making laminate substrate with sintered components
QORVO US INC0 citations60
US11929300B2Mar 12, 2024
Method for packaging an integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL)
QORVO US INC0 citations60
US11783998B2Oct 10, 2023
Process for making laminate substrate with sintered components
QORVO US INC0 citations60
US10906274B2Feb 2, 2021
Laminate substrate with sintered components
QORVO US INC0 citations60
US10217686B2Feb 26, 2019
Air-cavity package with enhanced package integration level and thermal performance
QORVO US INC0 citations50
US10141245B2Nov 27, 2018
High-power acoustic device with improved performance
QORVO US INC0 citations42
TRIQUINT SEMICONDUCTOR INC
5 patentsUS8946894B2Feb 3, 2015
Package for high-power semiconductor devices
TRIQUINT SEMICONDUCTOR INC6 citations83
US9793237B2Oct 17, 2017
Hollow-cavity flip-chip package with reinforced interconnects and process for making the same
TRIQUINT SEMICONDUCTOR INC5 citations72
US9659898B1May 23, 2017
Apparatuses, systems, and methods for die attach coatings for semiconductor packages
TRIQUINT SEMICONDUCTOR INC6 citations69
US9559034B2Jan 31, 2017
Package for high-power semiconductor devices
TRIQUINT SEMICONDUCTOR INC0 citations51
US9585240B2Feb 28, 2017
Advanced grounding scheme
TRIQUINT SEMICONDUCTOR INC0 citations31
RAILKAR TARAK A
4 patentsUS8921995B1Dec 30, 2014
Integrated circuit package including a three-dimensional fan-out/fan-in signal routing
RAILKAR TARAK A42 citations92
US8946904B2Feb 3, 2015
Substrate vias for heat removal from semiconductor die
RAILKAR TARAK A16 citations81
US8908383B1Dec 9, 2014
Thermal via structures with surface features
RAILKAR TARAK A16 citations78
US8304293B2Nov 6, 2012
Thermally enhanced semiconductor package
RAILKAR TARAK A4 citations61