P

Inventor

COLLINS ANDREW

US55 patents
⚠️ This page may combine multiple inventors who share the name “COLLINS ANDREW”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

20 patents
US10847467B2Nov 24, 2020

Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same

INTEL CORP21 citations94
US11270942B2Mar 8, 2022

Pitch translation architecture for semiconductor package including embedded interconnect bridge

INTEL CORP4 citations83
US11728294B2Aug 15, 2023

Capacitor die embedded in package substrate for providing capacitance to surface mounted die

INTEL CORP1 citations73
US11018124B2May 25, 2021

Embedded memory device and method for embedding memory device in a substrate

INTEL CORP2 citations73
US10490503B2Nov 26, 2019

Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same

INTEL CORP4 citations73
US12051647B2Jul 30, 2024

Pitch translation architecture for semiconductor package including embedded interconnect bridge

INTEL CORP2 citations72
US11705398B2Jul 18, 2023

Pitch translation architecture for semiconductor package including embedded interconnect bridge

INTEL CORP3 citations72
US10643945B2May 5, 2020

Pitch translation architecture for semiconductor package including embedded interconnect bridge

INTEL CORP2 citations72
US12512396B2Dec 30, 2025

Flexible die to floor planning with bump pitch scale through glass core via pitch

INTEL CORP0 citations62
US12388019B2Aug 12, 2025

Pitch translation architecture for semiconductor package including embedded interconnect bridge

INTEL CORP0 citations62
US12205924B2Jan 21, 2025

Semiconductor packages with chiplets coupled to a memory device

INTEL CORP0 citations62
US12046568B2Jul 23, 2024

Capacitor die embedded in package substrate for providing capacitance to surface mounted die

INTEL CORP0 citations62
US11621223B2Apr 4, 2023

Interconnect hub for dies

INTEL CORP1 citations62
US11610862B2Mar 21, 2023

Semiconductor packages with chiplets coupled to a memory device

INTEL CORP1 citations62
US11562993B2Jan 24, 2023

Embedded memory device and method for embedding memory device in a substrate

INTEL CORP1 citations62
US11222837B2Jan 11, 2022

Low-inductance current paths for on-package power distributions and methods of assembling same

INTEL CORP0 citations62
US11195805B2Dec 7, 2021

Capacitor die embedded in package substrate for providing capacitance to surface mounted die

INTEL CORP0 citations62
US10651117B2May 12, 2020

Low-inductance current paths for on-package power distributions and methods of assembling same

INTEL CORP1 citations62
US11456281B2Sep 27, 2022

Architecture and processes to enable high capacity memory packages through memory die stacking

INTEL CORP1 citations58
US11705390B2Jul 18, 2023

Variable in-plane signal to ground reference configurations

INTEL CORP0 citations48

SONY UK LTD

10 patents

MCGRATH MARK JOHN

4 patents

NAT STARCH CHEM INVEST

3 patents

Velcro BVBA

3 patents

VELCRO IP HOLDINGS LLC

3 patents

VELCRO IND

2 patents

SONY CORP

2 patents

SONY EUROPE LTD

1 patent

GRADY JAMES T

1 patent

DOMIN FLUID POWER LTD

1 patent

Showing the top 50 of 55 patents by PatentIndex Score.