Inventor
VISWANATH RAM
US22 patents
Patents
22 patentsUS6575766B1Jun 10, 2003
Laminated socket contacts
INTEL CORP20 citations91
US6189601B1Feb 20, 2001
Heat sink with a heat pipe for spreading of heat
INTEL CORP163 citations91
US11302643B2Apr 12, 2022
Microelectronic component having molded regions with through-mold vias
INTEL CORP5 citations83
US11270942B2Mar 8, 2022
Pitch translation architecture for semiconductor package including embedded interconnect bridge
INTEL CORP4 citations83
US12176292B2Dec 24, 2024
Microelectronic component having molded regions with through-mold vias
INTEL CORP2 citations72
US12051647B2Jul 30, 2024
Pitch translation architecture for semiconductor package including embedded interconnect bridge
INTEL CORP2 citations72
US11817390B2Nov 14, 2023
Microelectronic component having molded regions with through-mold vias
INTEL CORP2 citations72
US11705398B2Jul 18, 2023
Pitch translation architecture for semiconductor package including embedded interconnect bridge
INTEL CORP3 citations72
US10643945B2May 5, 2020
Pitch translation architecture for semiconductor package including embedded interconnect bridge
INTEL CORP2 citations72
US9674954B2Jun 6, 2017
Chip package connector assembly
INTEL CORP3 citations72
US9603247B2Mar 21, 2017
Electronic package with narrow-factor via including finish layer
INTEL CORP3 citations72
US11935808B2Mar 19, 2024
IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects
INTEL CORP2 citations71
US11574851B2Feb 7, 2023
Coupled cooling fins in ultra-small systems
INTEL CORP3 citations70
US12388019B2Aug 12, 2025
Pitch translation architecture for semiconductor package including embedded interconnect bridge
INTEL CORP0 citations62
US11640942B2May 2, 2023
Microelectronic component having molded regions with through-mold vias
INTEL CORP0 citations61
US6979208B2Dec 27, 2005
Laminated socket contacts
INTEL CORP3 citations61
US6854979B2Feb 15, 2005
Laminated socket contacts
INTEL CORP3 citations61
US6672880B2Jan 6, 2004
Laminated socket contacts
INTEL CORP2 citations61
US12283535B2Apr 22, 2025
IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects
INTEL CORP0 citations60
US11984377B2May 14, 2024
IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects
INTEL CORP0 citations60
US11545407B2Jan 3, 2023
Thermal management solutions for integrated circuit packages
INTEL CORP0 citations60
US11923267B2Mar 5, 2024
IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects
INTEL CORP0 citations50