Inventor
FEIERTAG GREGOR
DE17 patents
⚠️ This page may combine multiple inventors who share the name “FEIERTAG GREGOR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
EPCOS AG
6 patentsUS7388281B2Jun 17, 2008
Encapsulated electronic component and production method
EPCOS AG62 citations96
US7518201B2Apr 14, 2009
Method for encapsulating an electrical component, and surface acoustic wave device encapsulated using said method
EPCOS AG25 citations92
US7094626B2Aug 22, 2006
Method for encapsulating an electrical component
EPCOS AG15 citations84
US6909183B2Jun 21, 2005
Substrate for an electric component and method for the production thereof
EPCOS AG16 citations84
US7552532B2Jun 30, 2009
Method for hermetically encapsulating a component
EPCOS AG17 citations82
US10015600B2Jul 3, 2018
Multi-MEMS module
EPCOS AG2 citations73
FEIERTAG GREGOR
6 patentsUS8294535B2Oct 23, 2012
Electrical component and production method
FEIERTAG GREGOR28 citations92
US9056760B2Jun 16, 2015
Miniaturized electrical component comprising an MEMS and an ASIC and production method
FEIERTAG GREGOR12 citations83
US8571239B2Oct 29, 2013
MEMS microphone
FEIERTAG GREGOR11 citations83
US8674498B2Mar 18, 2014
MEMS package and method for the production thereof
FEIERTAG GREGOR4 citations70
US8580613B2Nov 12, 2013
Semiconductor chip arrangement with sensor chip and manufacturing method
FEIERTAG GREGOR4 citations62
US8553920B2Oct 8, 2013
Arrangement comprising a microphone
FEIERTAG GREGOR1 citations51
PAHL WOLFGANG
4 patentsUS9061888B2Jun 23, 2015
Sensor module and method for producing sensor modules
PAHL WOLFGANG6 citations73
US8865499B2Oct 21, 2014
MEMS microphone and method for producing the MEMS microphone
PAHL WOLFGANG6 citations73
US8674464B2Mar 18, 2014
MEMS component, method for producing a MEMS component, and method for handling a MEMS component
PAHL WOLFGANG1 citations52
US9051174B2Jun 9, 2015
Method for encapsulating an MEMS component
PAHL WOLFGANG0 citations41