Inventor
STELZL ALOIS
DE37 patents
⚠️ This page may combine multiple inventors who share the name “STELZL ALOIS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
EPCOS AG
14 patentsUS7388281B2Jun 17, 2008
Encapsulated electronic component and production method
EPCOS AG62 citations96
US7259041B2Aug 21, 2007
Method for the hermetic encapsulation of a component
EPCOS AG77 citations95
US6722030B1Apr 20, 2004
Process for manufacturing an electronic component, in particular a surface-wave component working with acoustic surface waves
EPCOS AG57 citations94
US6519822B1Feb 18, 2003
Method for producing an electronic component
EPCOS AG29 citations93
US7518201B2Apr 14, 2009
Method for encapsulating an electrical component, and surface acoustic wave device encapsulated using said method
EPCOS AG25 citations92
US6685168B1Feb 3, 2004
Surface acoustic wave component
EPCOS AG21 citations92
US6555758B1Apr 29, 2003
Multiple blank for electronic components such as SAW components, and method of building up bumps, solder frames, spacers and the like
EPCOS AG20 citations92
US6838739B2Jan 4, 2005
Component with a label
EPCOS AG27 citations89
US7608789B2Oct 27, 2009
Component arrangement provided with a carrier substrate
EPCOS AG15 citations84
US7544540B2Jun 9, 2009
Encapsulated electrical component and production method
EPCOS AG12 citations84
US7094626B2Aug 22, 2006
Method for encapsulating an electrical component
EPCOS AG15 citations84
US6909183B2Jun 21, 2005
Substrate for an electric component and method for the production thereof
EPCOS AG16 citations84
US7673386B2Mar 9, 2010
Flip-chip component production method
EPCOS AG9 citations82
US7552532B2Jun 30, 2009
Method for hermetically encapsulating a component
EPCOS AG17 citations82
BAUER CHRISTIAN
6 patentsUS8404516B2Mar 26, 2013
Method for producing a MEMS package
BAUER CHRISTIAN8 citations84
US9647196B2May 9, 2017
Wafer-level package and method for production thereof
BAUER CHRISTIAN14 citations83
US8110962B2Feb 7, 2012
MEMS component and method for production
BAUER CHRISTIAN4 citations63
US8759677B2Jun 24, 2014
Hermetically sealed housing for electronic components and manufacturing method
BAUER CHRISTIAN3 citations62
US9006868B2Apr 14, 2015
Encapsulation of an MEMS component and a method for producing said component
BAUER CHRISTIAN2 citations60
US9382110B2Jul 5, 2016
Component and method for producing a component
BAUER CHRISTIAN0 citations51
SIEMENS AG
4 patentsUS6528924B1Mar 4, 2003
Electronic component, in particular a component operating with surface acoustic waves
SIEMENS AG47 citations93
US6310420B1Oct 30, 2001
Electronic component in particular an saw component operating with surface acoustic waves and a method for its production
SIEMENS AG25 citations93
US6057222AMay 2, 2000
Method for the production of flip-chip mounting-ready contacts of electrical components
SIEMENS AG34 citations93
US6136175AOct 24, 2000
Method of producing an electronic component, in particular a surface acoustic wave component
SIEMENS AG27 citations92
SNAPTRACK INC
3 patentsUS9853204B2Dec 26, 2017
MEMS component and method for encapsulating MEMS components
SNAPTRACK INC8 citations82
US11245977B2Feb 8, 2022
Electric component with sensitive component structures and method for producing an electric component with sensitive component structures
SNAPTRACK INC0 citations61
US10164166B2Dec 25, 2018
MEMS component and method for encapsulating MEMS components
SNAPTRACK INC0 citations50
SIEMENS MATSUSHITA COMPONENTS
2 patentsUS6449828B2Sep 17, 2002
Method of producing a surface acoustic wave component
SIEMENS MATSUSHITA COMPONENTS68 citations96
US6242842B1Jun 5, 2001
Electrical component, in particular saw component operating with surface acoustic waves, and a method for its production
SIEMENS MATSUSHITA COMPONENTS23 citations93