Inventor
PETRARCA KEVIN SHAWN
US19 patents
Patents
19 patentsUS7115997B2Oct 3, 2006
Seedless wirebond pad plating
IBM17 citations92
US6819000B2Nov 16, 2004
High density area array solder microjoining interconnect structure and fabrication method
IBM28 citations92
US6732908B2May 11, 2004
High density raised stud microjoining system and methods of fabricating the same
IBM19 citations92
US6661098B2Dec 9, 2003
High density area array solder microjoining interconnect structure and fabrication method
IBM18 citations92
US7943412B2May 17, 2011
Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters
IBM24 citations91
US6864578B2Mar 8, 2005
Internally reinforced bond pads
IBM16 citations89
US12444653B2Oct 14, 2025
Buried power rail at tight cell-to-cell space
IBM2 citations74
US6747472B2Jun 8, 2004
Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same
IBM8 citations72
US7273804B2Sep 25, 2007
Internally reinforced bond pads
IBM6 citations71
US7825019B2Nov 2, 2010
Structures and methods for reduction of parasitic capacitances in semiconductor integrated circuits
IBM4 citations63
US7534651B2May 19, 2009
Seedless wirebond pad plating
IBM3 citations63
US12033981B2Jul 9, 2024
Create a protected layer for interconnects and devices in a packaged quantum structure
IBM0 citations62
US7855137B2Dec 21, 2010
Method of making a sidewall-protected metallic pillar on a semiconductor substrate
IBM6 citations62
US7833893B2Nov 16, 2010
Method for forming conductive structures
IBM5 citations62
US6982493B2Jan 3, 2006
Wedgebond pads having a nonplanar surface structure
IBM2 citations62
US7541277B1Jun 2, 2009
Stress relaxation, selective nitride phase removal
IBM2 citations61
US6284574B1Sep 4, 2001
Method of producing heat dissipating structure for semiconductor devices
IBM4 citations60
US12406930B2Sep 2, 2025
Structure containing a via-to-buried power rail contact structure or a via-to-backside power rail contact structure
IBM0 citations51
US12178142B2Dec 24, 2024
Layered substrate structures with aligned optical access to electrical devices
IBM0 citations50