Inventor
CHO KYONG-SOON
KR18 patents
⚠️ This page may combine multiple inventors who share the name “CHO KYONG-SOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
13 patentsUS10978409B2Apr 13, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD6 citations83
US7915727B2Mar 29, 2011
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same
SAMSUNG ELECTRONICS CO LTD8 citations82
US9865552B2Jan 9, 2018
Wafer level package
SAMSUNG ELECTRONICS CO LTD3 citations71
US9280182B2Mar 8, 2016
Chip on film package and display device including the same
SAMSUNG ELECTRONICS CO LTD5 citations71
US9059162B2Jun 16, 2015
Chip on film (COF) substrate, COF package and display device including the same
SAMSUNG ELECTRONICS CO LTD5 citations71
US11664330B2May 30, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US10262933B2Apr 16, 2019
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US9305990B2Apr 5, 2016
Chip-on-film package and device assembly including the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US8952510B2Feb 10, 2015
Semiconductor chip and film and tab package comprising the chip and film
SAMSUNG ELECTRONICS CO LTD3 citations61
US10600729B2Mar 24, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations52
US10105102B2Oct 23, 2018
Package for processing sensed-data, sensed-data processor, and system for processing sensed-data
SAMSUNG ELECTRONICS CO LTD1 citations51
US10672694B2Jun 2, 2020
Printed circuit board, semiconductor package including the printed circuit board, and method of manufacturing the printed circuit board
SAMSUNG ELECTRONICS CO LTD0 citations46
US9728497B2Aug 8, 2017
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations32