Inventor
LEE KWAN-JAI
KR12 patents
⚠️ This page may combine multiple inventors who share the name “LEE KWAN-JAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
8 patentsUS6878570B2Apr 12, 2005
Thin stacked package and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD83 citations96
US6849949B1Feb 1, 2005
Thin stacked package
SAMSUNG ELECTRONICS CO LTD108 citations96
US6087722AJul 11, 2000
Multi-chip package
SAMSUNG ELECTRONICS CO LTD260 citations96
US8853694B2Oct 7, 2014
Chip on film package including test pads and semiconductor devices including the same
SAMSUNG ELECTRONICS CO LTD20 citations92
US7339262B2Mar 4, 2008
Tape circuit substrate and semiconductor apparatus employing the same
SAMSUNG ELECTRONICS CO LTD8 citations73
US9280182B2Mar 8, 2016
Chip on film package and display device including the same
SAMSUNG ELECTRONICS CO LTD5 citations71
US9059162B2Jun 16, 2015
Chip on film (COF) substrate, COF package and display device including the same
SAMSUNG ELECTRONICS CO LTD5 citations71
US7247936B2Jul 24, 2007
Tape circuit substrate having wavy beam leads and semiconductor chip package using the same
SAMSUNG ELECTRONICS CO LTD4 citations62