Inventor

CHOI KYOUNG-SEI

KR21 patents

⚠️ This page may combine multiple inventors who share the name “CHOI KYOUNG-SEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHOI KYOUNG-SEI

SAMSUNG ELECTRONICS CO LTD

CMOS type image sensor module having transparent polymeric encapsulation material

CMOS type image sensor module having transparent polymeric encapsulation material

Stack type semiconductor package

Method for manufacturing tape wiring board

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

Semiconductor package

Semiconductor package

Image sensor package

Method for manufacturing tape wiring board

Method of cutting semiconductor wafer, semiconductor chip apparatus, and chamber to cut wafer

Circuit film with bump, film package using the same, and related fabrication methods

Flip chip packages

CHOI KYOUNG-SEI

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

Flexible substrate for a semiconductor package, method of manufacturing the same, and semiconductor package including flexible substrate

Method for manufacturing tape wiring board

Methods for forming circuit pattern forming region in an insulating substrate

YOO JAE-WOOK

Device for removing electromagnetic interference and semiconductor package including the same

Flexible heat sink having ventilation ports and semiconductor package including the same

LEE SI-HOON

Chip on flexible printed circuit type semiconductor package

PARK JI-YONG

Method of fabricating a semiconductor device package

CHO KYONG-SOON

Semiconductor chip package