Inventor
SHIMIZU AKITAKA
JP40 patents
⚠️ This page may combine multiple inventors who share the name “SHIMIZU AKITAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
31 patentsUS10541145B2Jan 21, 2020
Substrate processing apparatus and substrate processing method
TOKYO ELECTRON LTD8 citations82
US7811939B2Oct 12, 2010
Plasma etching method
TOKYO ELECTRON LTD12 citations82
US7527016B2May 5, 2009
Plasma processing apparatus
TOKYO ELECTRON LTD16 citations82
US11557486B2Jan 17, 2023
Etching method, damage layer removal method, and storage medium
TOKYO ELECTRON LTD3 citations73
US10053773B2Aug 21, 2018
Method of cleaning plasma processing apparatus
TOKYO ELECTRON LTD3 citations72
US10903083B2Jan 26, 2021
Substrate processing method, substrate processing apparatus and substrate processing system
TOKYO ELECTRON LTD2 citations71
US7514277B2Apr 7, 2009
Etching method and apparatus
TOKYO ELECTRON LTD6 citations63
US12500091B2Dec 16, 2025
Etching method, method of removing etching residue, and storage medium
TOKYO ELECTRON LTD0 citations62
US11024514B2Jun 1, 2021
Etching method and etching apparatus
TOKYO ELECTRON LTD0 citations62
US10975468B2Apr 13, 2021
Method of cleaning plasma processing apparatus
TOKYO ELECTRON LTD0 citations62
US9208997B2Dec 8, 2015
Method of etching copper layer and mask
TOKYO ELECTRON LTD2 citations62
US8383517B2Feb 26, 2013
Substrate processing method and substrate processing apparatus
TOKYO ELECTRON LTD2 citations62
US7871532B2Jan 18, 2011
Plasma processing method and post-processing method
TOKYO ELECTRON LTD6 citations62
US7604908B2Oct 20, 2009
Fine pattern forming method
TOKYO ELECTRON LTD3 citations62
US12237173B2Feb 25, 2025
Substrate processing method, substrate processing apparatus and substrate processing system
TOKYO ELECTRON LTD0 citations61
US10985029B2Apr 20, 2021
Substrate processing apparatus and substrate processing method
TOKYO ELECTRON LTD0 citations61
US11328904B2May 10, 2022
Substrate processing apparatus
TOKYO ELECTRON LTD0 citations60
US10734201B2Aug 4, 2020
Substrate processing apparatus
TOKYO ELECTRON LTD1 citations60
US7432172B2Oct 7, 2008
Plasma etching method
TOKYO ELECTRON LTD2 citations60
US12165848B2Dec 10, 2024
Substrate processing method, substrate processing apparatus, and method for producing nanowire or nanosheet transistor
TOKYO ELECTRON LTD0 citations59
US11443952B2Sep 13, 2022
Etching method and etching device
TOKYO ELECTRON LTD0 citations59
US7824931B2Nov 2, 2010
Substrate processing control method and storage medium
TOKYO ELECTRON LTD0 citations52
US9984892B2May 29, 2018
Oxide film removing method, oxide film removing apparatus, contact forming method, and contact forming system
TOKYO ELECTRON LTD1 citations51
US9882124B2Jan 30, 2018
Etching method and substrate processing apparatus
TOKYO ELECTRON LTD0 citations51
US9139901B2Sep 22, 2015
Plasma processing method
TOKYO ELECTRON LTD1 citations51
US7897498B2Mar 1, 2011
Method for manufacturing semiconductor device
TOKYO ELECTRON LTD0 citations51
US7256135B2Aug 14, 2007
Etching method and computer storage medium storing program for controlling same
TOKYO ELECTRON LTD1 citations50
US7192532B2Mar 20, 2007
Dry etching method
TOKYO ELECTRON LTD0 citations50
US10923329B2Feb 16, 2021
Substrate processing apparatus and substrate processing method
TOKYO ELECTRON LTD0 citations49
US10923358B2Feb 16, 2021
Substrate processing method
TOKYO ELECTRON LTD0 citations49
US7179752B2Feb 20, 2007
Dry etching method
TOKYO ELECTRON LTD1 citations49