Inventor
HAWKINS GEORGE W
US18 patents
⚠️ This page may combine multiple inventors who share the name “HAWKINS GEORGE W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
12 patentsUS5385869AJan 31, 1995
Semiconductor chip bonded to a substrate and method of making
MOTOROLA INC171 citations97
US4989069AJan 29, 1991
Semiconductor package having leads that break-away from supports
MOTOROLA INC95 citations96
US5756380AMay 26, 1998
Method for making a moisture resistant semiconductor device having an organic substrate
MOTOROLA INC113 citations95
US5119171AJun 2, 1992
Semiconductor die having rounded or tapered edges and corners
MOTOROLA INC27 citations92
US4924291AMay 8, 1990
Flagless semiconductor package
MOTOROLA INC27 citations92
US4928162AMay 22, 1990
Die corner design having topological configurations
MOTOROLA INC35 citations91
US4740868AApr 26, 1988
Rail bonded multi-chip leadframe, method and package
MOTOROLA INC19 citations82
US5747858AMay 5, 1998
Electronic component having an interconnect substrate adjacent to a side surface of a device substrate
MOTOROLA INC10 citations73
US4832996AMay 23, 1989
Semiconductor die for plastic encapsulation having an adhesion promoter
MOTOROLA INC6 citations63
US5860210AJan 19, 1999
Method of manufacturing an electronic component
MOTOROLA INC4 citations62
US4872088AOct 3, 1989
Radial mounting for stacked wafer modules with cooling
MOTOROLA INC4 citations62
US5556793ASep 17, 1996
Method of making a structure for top surface gettering of metallic impurities
MOTOROLA INC4 citations58