Inventor

BOON SUAN JEUNG

SG54 patents

⚠️ This page may combine multiple inventors who share the name “BOON SUAN JEUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BOON SUAN JEUNG

MICRON TECHNOLOGY INC

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Wafer level pre-packaged flip chip systems

Method of making multichip wafer level packages and computing systems incorporating same

Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a lead

Castellated chip-scale packages and methods for fabricating the same

Adhesive layer for an electronic apparatus having multiple semiconductor devices

Method of forming a conductive via through a wafer

Multi-chip wafer level system packages and methods of forming same

Multichip wafer level packages and computing systems incorporating same

Castellation wafer level packaging of integrated circuit chips

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Interconnects for packaged semiconductor devices and methods for manufacturing such devices

Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding material

Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages

Wafer level packaging

Method for packaging circuits and packaged circuits

Super high density module with integrated wafer level packages

Super high density module with integrated wafer level packages

Leadless packaging for image sensor devices

Leadless packaging for image sensor devices and methods of assembly

Multichip wafer level packages and computing systems incorporating same

Multiple chip semiconductor package and method of fabricating same

Multiple chip semiconductor package

Multiple chip semiconductor package

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Wafer level pre-packaged flip chip

Super high density module with integrated wafer level packages

Wafer level pre-packaged flip chip

Wafer level pre-packaged flip chip system

Semiconductor assemblies and methods of manufacturing such assemblies including trenches in a molding material between semiconductor die

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Castellation wafer level packaging of integrated circuit chips

Methods and apparatus for testing and burn-in of semiconductor devices

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Multiple chip semiconductor package

Castellation wafer level packaging of integrated circuit chips

Packaged semiconductor assemblies and methods for manufacturing such assemblies

CHIA YONG POO

Method for packaging circuits

Method for packaging circuits

Super high-density module with integrated wafer level packages

Super high-density module with integrated wafer level packages

BOON SUAN JEUNG

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Semiconductor device assemblies and packages

Packaged semiconductor assemblies and methods for manufacturing such assemblies

ENG MEOW KOON

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods

CHUA SWEE KWANG

Wafer level packaging

Wafer level packaging