Inventor
LOW SIU WAF
SG29 patents
⚠️ This page may combine multiple inventors who share the name “LOW SIU WAF”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
20 patentsUS7485562B2Feb 3, 2009
Method of making multichip wafer level packages and computing systems incorporating same
MICRON TECHNOLOGY INC141 citations99
US6882021B2Apr 19, 2005
Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a lead
MICRON TECHNOLOGY INC157 citations99
US7208335B2Apr 24, 2007
Castellated chip-scale packages and methods for fabricating the same
MICRON TECHNOLOGY INC62 citations98
US6964881B2Nov 15, 2005
Multi-chip wafer level system packages and methods of forming same
MICRON TECHNOLOGY INC51 citations96
US6825553B2Nov 30, 2004
Multichip wafer level packages and computing systems incorporating same
MICRON TECHNOLOGY INC44 citations96
US7193312B2Mar 20, 2007
Castellation wafer level packaging of integrated circuit chips
MICRON TECHNOLOGY INC32 citations95
US7633159B2Dec 15, 2009
Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages
MICRON TECHNOLOGY INC26 citations93
US7579681B2Aug 25, 2009
Super high density module with integrated wafer level packages
MICRON TECHNOLOGY INC28 citations92
US7368374B2May 6, 2008
Super high density module with integrated wafer level packages
MICRON TECHNOLOGY INC24 citations92
US7274094B2Sep 25, 2007
Leadless packaging for image sensor devices
MICRON TECHNOLOGY INC39 citations92
US7112471B2Sep 26, 2006
Leadless packaging for image sensor devices and methods of assembly
MICRON TECHNOLOGY INC27 citations92
US7087992B2Aug 8, 2006
Multichip wafer level packages and computing systems incorporating same
MICRON TECHNOLOGY INC21 citations92
US6987031B2Jan 17, 2006
Multiple chip semiconductor package and method of fabricating same
MICRON TECHNOLOGY INC27 citations92
US6958537B2Oct 25, 2005
Multiple chip semiconductor package
MICRON TECHNOLOGY INC32 citations92
US7173330B2Feb 6, 2007
Multiple chip semiconductor package
MICRON TECHNOLOGY INC17 citations91
US7884007B2Feb 8, 2011
Super high density module with integrated wafer level packages
MICRON TECHNOLOGY INC8 citations84
US7304375B2Dec 4, 2007
Castellation wafer level packaging of integrated circuit chips
MICRON TECHNOLOGY INC5 citations73
US6856155B2Feb 15, 2005
Methods and apparatus for testing and burn-in of semiconductor devices
MICRON TECHNOLOGY INC9 citations71
US7553697B2Jun 30, 2009
Multiple chip semiconductor package
MICRON TECHNOLOGY INC1 citations63
US7271027B2Sep 18, 2007
Castellation wafer level packaging of integrated circuit chips
MICRON TECHNOLOGY INC2 citations62
TEXAS INSTRUMENTS INC
6 patentsUS5952611ASep 14, 1999
Flexible pin location integrated circuit package
TEXAS INSTRUMENTS INC216 citations98
US6137164AOct 24, 2000
Thin stacked integrated circuit device
TEXAS INSTRUMENTS INC326 citations96
US6387729B2May 14, 2002
Method for adhering and sealing a silicon chip in an integrated circuit package
TEXAS INSTRUMENTS INC48 citations95
US6365833B1Apr 2, 2002
Integrated circuit package
TEXAS INSTRUMENTS INC70 citations95
US6087203AJul 11, 2000
Method for adhering and sealing a silicon chip in an integrated circuit package
TEXAS INSTRUMENTS INC45 citations95
US6236107B1May 22, 2001
Encapsulate resin LOC package and method of fabrication
TEXAS INSTRUMENTS INC33 citations92