Inventor

NEO YONG LOO

SG22 patents

⚠️ This page may combine multiple inventors who share the name “NEO YONG LOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NEO YONG LOO

MICRON TECHNOLOGY INC

Method of making multichip wafer level packages and computing systems incorporating same

Method of forming a conductive via through a wafer

Multi-chip wafer level system packages and methods of forming same

Multichip wafer level packages and computing systems incorporating same

Castellation wafer level packaging of integrated circuit chips

Wafer level packaging

Super high density module with integrated wafer level packages

Super high density module with integrated wafer level packages

Leadless packaging for image sensor devices

Leadless packaging for image sensor devices and methods of assembly

Multichip wafer level packages and computing systems incorporating same

Multiple chip semiconductor package and method of fabricating same

Multiple chip semiconductor package

Multiple chip semiconductor package

Super high density module with integrated wafer level packages

Castellation wafer level packaging of integrated circuit chips

Multiple chip semiconductor package

Castellation wafer level packaging of integrated circuit chips

CHIA YONG POO

Super high-density module with integrated wafer level packages

Super high-density module with integrated wafer level packages

APTINA IMAGING CORP

Microelectronic imagers and methods for manufacturing such microelectronic imagers

CHUA SWEE KWANG

Wafer level packaging