P

Inventor

SER BOK LENG

SG8 patents
⚠️ This page may combine multiple inventors who share the name “SER BOK LENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

4 patents
US7579681B2Aug 25, 2009

Super high density module with integrated wafer level packages

MICRON TECHNOLOGY INC28 citations92
US7368374B2May 6, 2008

Super high density module with integrated wafer level packages

MICRON TECHNOLOGY INC24 citations92
US7884007B2Feb 8, 2011

Super high density module with integrated wafer level packages

MICRON TECHNOLOGY INC8 citations84
US9418872B2Aug 16, 2016

Packaged microelectronic components

MICRON TECHNOLOGY INC1 citations59

CHIA YONG POO

2 patents
US8304894B2Nov 6, 2012

Super high-density module with integrated wafer level packages

CHIA YONG POO6 citations83
US8698295B2Apr 15, 2014

Super high-density module with integrated wafer level packages

CHIA YONG POO2 citations61

TEXAS INSTRUMENTS INC

1 patent
US5956233ASep 21, 1999

High density single inline memory module

TEXAS INSTRUMENTS INC132 citations96

INST OF TECHNICAL EDUCATION

1 patent
US9806013B2Oct 31, 2017

Multilayer structure for a semiconductor device and a method of forming a multilayer structure for a semiconductor device

INST OF TECHNICAL EDUCATION0 citations38