Inventor
PARK HYUNG-JUN
KR94 patents
⚠️ This page may combine multiple inventors who share the name “PARK HYUNG-JUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG DISPLAY CO LTD
37 patentsUS10748472B2Aug 18, 2020
Display device
SAMSUNG DISPLAY CO LTD18 citations94
US10636859B2Apr 28, 2020
Display device
SAMSUNG DISPLAY CO LTD31 citations94
US10516016B2Dec 24, 2019
Display device
SAMSUNG DISPLAY CO LTD24 citations94
US10510822B2Dec 17, 2019
Display device
SAMSUNG DISPLAY CO LTD18 citations94
US10504446B2Dec 10, 2019
Display device
SAMSUNG DISPLAY CO LTD18 citations94
US10490119B2Nov 26, 2019
Display device
SAMSUNG DISPLAY CO LTD25 citations94
US10467958B2Nov 5, 2019
Display device and driving method thereof
SAMSUNG DISPLAY CO LTD14 citations94
US10403193B2Sep 3, 2019
Display device
SAMSUNG DISPLAY CO LTD19 citations94
US10115780B2Oct 30, 2018
Display device
SAMSUNG DISPLAY CO LTD19 citations94
US11721269B2Aug 8, 2023
Display device
SAMSUNG DISPLAY CO LTD4 citations86
US10943967B2Mar 9, 2021
Display device having conductive patterns with reduced display element overlap
SAMSUNG DISPLAY CO LTD10 citations86
US10777628B2Sep 15, 2020
Display device
SAMSUNG DISPLAY CO LTD7 citations84
US10769999B2Sep 8, 2020
Display device and driving method thereof
SAMSUNG DISPLAY CO LTD9 citations84
US10529792B2Jan 7, 2020
Display device
SAMSUNG DISPLAY CO LTD5 citations84
US10475389B2Nov 12, 2019
Display device
SAMSUNG DISPLAY CO LTD7 citations84
US10210798B2Feb 19, 2019
Display device having protective structure
SAMSUNG DISPLAY CO LTD9 citations84
US10199449B2Feb 5, 2019
Display device
SAMSUNG DISPLAY CO LTD12 citations84
US9711098B2Jul 18, 2017
Display apparatus with dummy pixel row and method of driving the display apparatus
SAMSUNG DISPLAY CO LTD9 citations84
US11963410B2Apr 16, 2024
Display device having conductive patterns with reduced display element overlap
SAMSUNG DISPLAY CO LTD1 citations73
US11849615B2Dec 19, 2023
Display device with protection against electrostatic discharge
SAMSUNG DISPLAY CO LTD1 citations73
US11741885B2Aug 29, 2023
Display device having plurality of initialization power sources
SAMSUNG DISPLAY CO LTD1 citations73
US11694614B2Jul 4, 2023
Display device
SAMSUNG DISPLAY CO LTD1 citations73
US11568817B2Jan 31, 2023
Display device and driving method thereof
SAMSUNG DISPLAY CO LTD1 citations73
US11362166B2Jun 14, 2022
Display device having conductive patterns with reduced display element overlap
SAMSUNG DISPLAY CO LTD1 citations73
US11289566B2Mar 29, 2022
Display device
SAMSUNG DISPLAY CO LTD2 citations73
US11271068B2Mar 8, 2022
Display device having differently sized regions capable of uniform luminance
SAMSUNG DISPLAY CO LTD2 citations73
US11257896B2Feb 22, 2022
Display device
SAMSUNG DISPLAY CO LTD4 citations73
US11257422B2Feb 22, 2022
Display device having a plurality of initialization power sources
SAMSUNG DISPLAY CO LTD3 citations73
US11227531B2Jan 18, 2022
Display device
SAMSUNG DISPLAY CO LTD1 citations73
US11164497B2Nov 2, 2021
Display device
SAMSUNG DISPLAY CO LTD1 citations73
US11120737B2Sep 14, 2021
Display device
SAMSUNG DISPLAY CO LTD3 citations73
US10903301B2Jan 26, 2021
Display device
SAMSUNG DISPLAY CO LTD2 citations73
US10770535B2Sep 8, 2020
Display device
SAMSUNG DISPLAY CO LTD4 citations73
US10713988B2Jul 14, 2020
Display device
SAMSUNG DISPLAY CO LTD3 citations73
US10126606B2Nov 13, 2018
Liquid crystal display panel
SAMSUNG DISPLAY CO LTD2 citations73
US9927661B2Mar 27, 2018
Liquid crystal display and method of manufacturing the same
SAMSUNG DISPLAY CO LTD6 citations72
US11068096B2Jul 20, 2021
Display device
SAMSUNG DISPLAY CO LTD2 citations71
ADVANCED SEMICONDUCTOR ENG
9 patentsUS6342730B1Jan 29, 2002
Low-pin-count chip package and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG148 citations98
US6861295B2Mar 1, 2005
Low-pin-count chip package and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG51 citations96
US6489218B1Dec 3, 2002
Singulation method used in leadless packaging process
ADVANCED SEMICONDUCTOR ENG150 citations96
US7087462B1Aug 8, 2006
Method for forming leadless semiconductor packages
ADVANCED SEMICONDUCTOR ENG81 citations95
US6242284B1Jun 5, 2001
Method for packaging a semiconductor chip
ADVANCED SEMICONDUCTOR ENG31 citations92
US7125747B2Oct 24, 2006
Process for manufacturing leadless semiconductor packages including an electrical test in a matrix of a leadless leadframe
ADVANCED SEMICONDUCTOR ENG50 citations91
US6773961B1Aug 10, 2004
Singulation method used in leadless packaging process
ADVANCED SEMICONDUCTOR ENG42 citations91
US6984878B2Jan 10, 2006
Leadless leadframe with an improved die pad for mold locking
ADVANCED SEMICONDUCTOR ENG22 citations90
US7205658B2Apr 17, 2007
Singulation method used in leadless packaging process
ADVANCED SEMICONDUCTOR ENG8 citations72
NEOFECT CO LTD
1 patentPARK HYUNG JUN
1 patentPARK KYUNG-HO
1 patentSAMSUNG ELECTRONICS CO LTD
1 patentShowing the top 50 of 94 patents by PatentIndex Score.