Inventor
DOBASHI MAKOTO
JP22 patents
⚠️ This page may combine multiple inventors who share the name “DOBASHI MAKOTO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUI MINING & SMELTING CO
18 patentsUS6335099B1Jan 1, 2002
Corrosion resistant, magnesium-based product exhibiting luster of base metal and method for producing the same
MITSUI MINING & SMELTING CO37 citations92
US6183880B1Feb 6, 2001
Composite foil of aluminum and copper
MITSUI MINING & SMELTING CO46 citations92
US5958209ASep 28, 1999
High tensile strength electrodeposited copper foil and process of electrodepositing thereof
MITSUI MINING & SMELTING CO33 citations92
US6541126B1Apr 1, 2003
Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil
MITSUI MINING & SMELTING CO30 citations90
US6777108B1Aug 17, 2004
Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil
MITSUI MINING & SMELTING CO20 citations86
US7524552B2Apr 28, 2009
Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layer
MITSUI MINING & SMELTING CO8 citations83
US6649274B1Nov 18, 2003
Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil
MITSUI MINING & SMELTING CO13 citations82
US7811709B2Oct 12, 2010
Negative electrode for nonaqueous secondary battery, process of producing the negative electrode, and nonaqueous secondary battery
MITSUI MINING & SMELTING CO18 citations79
US6194056B1Feb 27, 2001
High tensile strength electrodeposited copper foil
MITSUI MINING & SMELTING CO13 citations73
US6984453B2Jan 10, 2006
Electrolyte copper foil having carrier foil, manufacturing method thereof, and layered plate using the electrolyte copper foil having carrier foil
MITSUI MINING & SMELTING CO7 citations72
US6322904B1Nov 27, 2001
Copper foil for printed circuit boards
MITSUI MINING & SMELTING CO13 citations72
US6610418B1Aug 26, 2003
Electolytic copper foil with carrier foil and method for manufacturing the same
MITSUI MINING & SMELTING CO7 citations71
US6544664B1Apr 8, 2003
Copper foil for printed wiring board
MITSUI MINING & SMELTING CO12 citations71
US6071629AJun 6, 2000
Organic rust-proof treated copper foil
MITSUI MINING & SMELTING CO2 citations62
US7455931B2Nov 25, 2008
Negative electrode for non-aqueous electrolyte secondary cell and method for manufacture thereof, and non-aqueous electrolyte secondary cell
MITSUI MINING & SMELTING CO4 citations61
US6652725B2Nov 25, 2003
Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatus
MITSUI MINING & SMELTING CO4 citations61
US7217464B2May 15, 2007
Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method
MITSUI MINING & SMELTING CO2 citations60
US6835297B1Dec 28, 2004
High current density electrolytic decomposition process for copper
MITSUI MINING & SMELTING CO1 citations51