Inventor
HSIAO YU-KUNG
TW19 patents
⚠️ This page may combine multiple inventors who share the name “HSIAO YU-KUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
18 patentsUS6821810B1Nov 23, 2004
High transmittance overcoat for optimization of long focal length microlens arrays in semiconductor color imagers
TAIWAN SEMICONDUCTOR MFG166 citations98
US6395576B1May 28, 2002
High efficiency color filter process to improve color balance in semiconductor array imaging devices
TAIWAN SEMICONDUCTOR MFG89 citations97
US6171883B1Jan 9, 2001
Image array optoelectronic microelectronic fabrication with enhanced optical stability and method for fabrication thereof
TAIWAN SEMICONDUCTOR MFG95 citations97
US6582988B1Jun 24, 2003
Method for forming micro lens structures
TAIWAN SEMICONDUCTOR MFG48 citations92
US6531266B1Mar 11, 2003
Rework procedure for the microlens element of a CMOS image sensor
TAIWAN SEMICONDUCTOR MFG32 citations92
US7009772B2Mar 7, 2006
High transmittance overcoat for microlens arrays in semiconductor color imagers
TAIWAN SEMICONDUCTOR MFG33 citations91
US6849533B2Feb 1, 2005
Method for fabricating microelectronic product with attenuated bond pad corrosion
TAIWAN SEMICONDUCTOR MFG25 citations91
US7372497B2May 13, 2008
Effective method to improve sub-micron color filter sensitivity
TAIWAN SEMICONDUCTOR MFG23 citations90
US6590239B2Jul 8, 2003
Color filter image array optoelectronic microelectronic fabrication with a planarizing layer formed upon a concave surfaced color filter region
TAIWAN SEMICONDUCTOR MFG31 citations90
US6417022B1Jul 9, 2002
Method for making long focal length micro-lens for color filters
TAIWAN SEMICONDUCTOR MFG44 citations90
US6956253B2Oct 18, 2005
Color filter with resist material in scribe lines
TAIWAN SEMICONDUCTOR MFG13 citations83
US6878642B1Apr 12, 2005
Method to improve passivation openings by reflow of photoresist to eliminate tape residue
TAIWAN SEMICONDUCTOR MFG9 citations74
US6623912B1Sep 23, 2003
Method to form the ring shape contact to cathode on wafer edge for electroplating in the bump process when using the negative type dry film photoresist
TAIWAN SEMICONDUCTOR MFG7 citations74
US7507598B2Mar 24, 2009
Image sensor fabrication method and structure
TAIWAN SEMICONDUCTOR MFG6 citations72
US7071032B2Jul 4, 2006
Material to improve image sensor yield during wafer sawing
TAIWAN SEMICONDUCTOR MFG5 citations62
US6759276B1Jul 6, 2004
Material to improve CMOS image sensor yield during wafer sawing
TAIWAN SEMICONDUCTOR MFG4 citations62
US6511779B1Jan 28, 2003
Method for fabricating high resolution color filter image array optoelectronic microelectronic fabrication
TAIWAN SEMICONDUCTOR MFG5 citations57
US6660641B1Dec 9, 2003
Method for forming crack resistant planarizing layer within microelectronic fabrication
TAIWAN SEMICONDUCTOR MFG0 citations51