Inventor
HUA YAPING
CN4 patents
Patents
4 patentsUS6712983B2Mar 30, 2004
Method of etching a deep trench in a substrate and method of fabricating on-chip devices and micro-machined structures using the same
MEMSIC INC43 citations91
US7495462B2Feb 24, 2009
Method of wafer-level packaging using low-aspect ratio through-wafer holes
MEMSIC INC23 citations90
US7424826B2Sep 16, 2008
Single chip tri-axis accelerometer
MEMSIC INC16 citations82
US8011226B2Sep 6, 2011
Leakage detection method using micromachined-thermal-convection accelerometer
MEMSIC INC5 citations54