Inventor
LI ZONGYA
CN5 patents
⚠️ This page may combine multiple inventors who share the name “LI ZONGYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MEMSIC INC
4 patentsUS7495462B2Feb 24, 2009
Method of wafer-level packaging using low-aspect ratio through-wafer holes
MEMSIC INC23 citations90
US7536909B2May 26, 2009
Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same
MEMSIC INC40 citations89
US8011226B2Sep 6, 2011
Leakage detection method using micromachined-thermal-convection accelerometer
MEMSIC INC5 citations54
US7617599B2Nov 17, 2009
Sensor packaging method for a human contact interface
MEMSIC INC0 citations35