Inventor
YU YONGSIK
US20 patents
⚠️ This page may combine multiple inventors who share the name “YU YONGSIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NOVELLUS SYSTEMS INC
13 patentsUS7727880B1Jun 1, 2010
Protective self-aligned buffer layers for damascene interconnects
NOVELLUS SYSTEMS INC332 citations99
US7576006B1Aug 18, 2009
Protective self-aligned buffer layers for damascene interconnects
NOVELLUS SYSTEMS INC55 citations98
US7915166B1Mar 29, 2011
Diffusion barrier and etch stop films
NOVELLUS SYSTEMS INC70 citations96
US7282438B1Oct 16, 2007
Low-k SiC copper diffusion barrier films
NOVELLUS SYSTEMS INC53 citations95
US7239017B1Jul 3, 2007
Low-k B-doped SiC copper diffusion barrier films
NOVELLUS SYSTEMS INC42 citations95
US8021486B1Sep 20, 2011
Protective self-aligned buffer layers for damascene interconnects
NOVELLUS SYSTEMS INC14 citations92
US7981777B1Jul 19, 2011
Methods of depositing stable and hermetic ashable hardmask films
NOVELLUS SYSTEMS INC42 citations92
US7968436B1Jun 28, 2011
Low-K SiC copper diffusion barrier films
NOVELLUS SYSTEMS INC15 citations92
US7842604B1Nov 30, 2010
Low-k b-doped SiC copper diffusion barrier films
NOVELLUS SYSTEMS INC17 citations92
US7704873B1Apr 27, 2010
Protective self-aligned buffer layers for damascene interconnects
NOVELLUS SYSTEMS INC14 citations92
US7573061B1Aug 11, 2009
Low-k SiC copper diffusion barrier films
NOVELLUS SYSTEMS INC24 citations92
US7420275B1Sep 2, 2008
Boron-doped SIC copper diffusion barrier films
NOVELLUS SYSTEMS INC39 citations92
US7163889B2Jan 16, 2007
Film for copper diffusion barrier
NOVELLUS SYSTEMS INC29 citations91
LAM RES CORP
4 patentsUS10002787B2Jun 19, 2018
Staircase encapsulation in 3D NAND fabrication
LAM RES CORP28 citations94
US10580690B2Mar 3, 2020
Staircase encapsulation in 3D NAND fabrication
LAM RES CORP15 citations86
US11670516B2Jun 6, 2023
Metal-containing passivation for high aspect ratio etch
LAM RES CORP3 citations72
US11062897B2Jul 13, 2021
Metal doped carbon based hard mask removal in semiconductor fabrication
LAM RES CORP4 citations67