Inventor
MOUNTSIER THOMAS W
US15 patents
⚠️ This page may combine multiple inventors who share the name “MOUNTSIER THOMAS W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NOVELLUS SYSTEMS INC
10 patentsUS5872058AFeb 16, 1999
High aspect ratio gapfill process by using HDP
NOVELLUS SYSTEMS INC426 citations99
US7396759B1Jul 8, 2008
Protection of Cu damascene interconnects by formation of a self-aligned buffer layer
NOVELLUS SYSTEMS INC105 citations97
US7239017B1Jul 3, 2007
Low-k B-doped SiC copper diffusion barrier films
NOVELLUS SYSTEMS INC42 citations95
US6200412B1Mar 13, 2001
Chemical vapor deposition system including dedicated cleaning gas injection
NOVELLUS SYSTEMS INC181 citations94
US9230800B2Jan 5, 2016
Plasma activated conformal film deposition
NOVELLUS SYSTEMS INC41 citations93
US8030777B1Oct 4, 2011
Protection of Cu damascene interconnects by formation of a self-aligned buffer layer
NOVELLUS SYSTEMS INC18 citations92
US7842604B1Nov 30, 2010
Low-k b-doped SiC copper diffusion barrier films
NOVELLUS SYSTEMS INC17 citations92
US7420275B1Sep 2, 2008
Boron-doped SIC copper diffusion barrier films
NOVELLUS SYSTEMS INC39 citations92
US6265320B1Jul 24, 2001
Method of minimizing reactive ion etch damage of organic insulating layers in semiconductor fabrication
NOVELLUS SYSTEMS INC54 citations92
US8053861B2Nov 8, 2011
Diffusion barrier layers
NOVELLUS SYSTEMS INC12 citations84
LAM RES CORP
4 patentsUS6875699B1Apr 5, 2005
Method for patterning multilevel interconnects
LAM RES CORP15 citations82
US9018103B2Apr 28, 2015
High aspect ratio etch with combination mask
LAM RES CORP5 citations73
US10242883B2Mar 26, 2019
High aspect ratio etch of oxide metal oxide metal stack
LAM RES CORP0 citations52
US9659783B2May 23, 2017
High aspect ratio etch with combination mask
LAM RES CORP1 citations52