P

Inventor

SHIH HUI-SHEN

TW30 patents
⚠️ This page may combine multiple inventors who share the name “SHIH HUI-SHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

20 patents
US8035191B2Oct 11, 2011

Contact efuse structure

UNITED MICROELECTRONICS CORP19 citations91
US7851247B2Dec 14, 2010

Method of fabricating micro-electromechanical system microphone structure

UNITED MICROELECTRONICS CORP8 citations84
US6416615B1Jul 9, 2002

Device for detecting abnormality in chemical-mechanical polishing operation

UNITED MICROELECTRONICS CORP8 citations72
US7833818B2Nov 16, 2010

Integrated structure of MEMS device and CMOS image sensor device and fabricating method thereof

UNITED MICROELECTRONICS CORP3 citations62
US7795056B2Sep 14, 2010

Semiconductor device and method of fabricating the same

UNITED MICROELECTRONICS CORP4 citations62
US7662645B2Feb 16, 2010

Reworked integrated circuit device and reworking method thereof

UNITED MICROELECTRONICS CORP3 citations62
US7557025B2Jul 7, 2009

Method of etching a dielectric layer to form a contact hole and a via hole and damascene method

UNITED MICROELECTRONICS CORP2 citations62
US7957827B2Jun 7, 2011

Method of controlling statuses of wafers

UNITED MICROELECTRONICS CORP4 citations60
US7008302B2Mar 7, 2006

Chemical mechanical polishing equipment and conditioning thereof

UNITED MICROELECTRONICS CORP5 citations56
US7828625B2Nov 9, 2010

Method of supplying polishing liquid

UNITED MICROELECTRONICS CORP4 citations55
US9564507B2Feb 7, 2017

Interlayer dielectric layer with two tensile dielectric layers

UNITED MICROELECTRONICS CORP0 citations52
US9281238B2Mar 8, 2016

Method for fabricating interlayer dielectric layer

UNITED MICROELECTRONICS CORP0 citations52
US7732332B2Jun 8, 2010

Chemical mechanical polishing method with inspection pre and post processing

UNITED MICROELECTRONICS CORP0 citations52
US6267654B1Jul 31, 2001

Pad backer for polishing head of chemical mechanical polishing machine

UNITED MICROELECTRONICS CORP0 citations51
US7510964B2Mar 31, 2009

Method for manufacturing semiconductor device that includes baking a dielectric layer after exposure to plasma

UNITED MICROELECTRONICS CORP0 citations47
US7909677B2Mar 22, 2011

Method of transferring a wafer

UNITED MICROELECTRONICS CORP1 citations46
US7731572B2Jun 8, 2010

CMP head

UNITED MICROELECTRONICS CORP1 citations45
US7482244B2Jan 27, 2009

Method of preventing a peeling issue of a high stressed thin film

UNITED MICROELECTRONICS CORP0 citations45
US7732009B2Jun 8, 2010

Method of cleaning reaction chamber, method of forming protection film and protection wafer

UNITED MICROELECTRONICS CORP0 citations40
US7967960B2Jun 28, 2011

Fluid-confining apparatus

UNITED MICROELECTRONICS CORP0 citations39

SHIH HUI-SHEN

8 patents

YANG KUO-WEI

1 patent

HU SHU-HUI

1 patent