Inventor
SHIH HUI-SHEN
TW30 patents
⚠️ This page may combine multiple inventors who share the name “SHIH HUI-SHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
20 patentsUS8035191B2Oct 11, 2011
Contact efuse structure
UNITED MICROELECTRONICS CORP19 citations91
US7851247B2Dec 14, 2010
Method of fabricating micro-electromechanical system microphone structure
UNITED MICROELECTRONICS CORP8 citations84
US6416615B1Jul 9, 2002
Device for detecting abnormality in chemical-mechanical polishing operation
UNITED MICROELECTRONICS CORP8 citations72
US7833818B2Nov 16, 2010
Integrated structure of MEMS device and CMOS image sensor device and fabricating method thereof
UNITED MICROELECTRONICS CORP3 citations62
US7795056B2Sep 14, 2010
Semiconductor device and method of fabricating the same
UNITED MICROELECTRONICS CORP4 citations62
US7662645B2Feb 16, 2010
Reworked integrated circuit device and reworking method thereof
UNITED MICROELECTRONICS CORP3 citations62
US7557025B2Jul 7, 2009
Method of etching a dielectric layer to form a contact hole and a via hole and damascene method
UNITED MICROELECTRONICS CORP2 citations62
US7957827B2Jun 7, 2011
Method of controlling statuses of wafers
UNITED MICROELECTRONICS CORP4 citations60
US7008302B2Mar 7, 2006
Chemical mechanical polishing equipment and conditioning thereof
UNITED MICROELECTRONICS CORP5 citations56
US7828625B2Nov 9, 2010
Method of supplying polishing liquid
UNITED MICROELECTRONICS CORP4 citations55
US9564507B2Feb 7, 2017
Interlayer dielectric layer with two tensile dielectric layers
UNITED MICROELECTRONICS CORP0 citations52
US9281238B2Mar 8, 2016
Method for fabricating interlayer dielectric layer
UNITED MICROELECTRONICS CORP0 citations52
US7732332B2Jun 8, 2010
Chemical mechanical polishing method with inspection pre and post processing
UNITED MICROELECTRONICS CORP0 citations52
US6267654B1Jul 31, 2001
Pad backer for polishing head of chemical mechanical polishing machine
UNITED MICROELECTRONICS CORP0 citations51
US7510964B2Mar 31, 2009
Method for manufacturing semiconductor device that includes baking a dielectric layer after exposure to plasma
UNITED MICROELECTRONICS CORP0 citations47
US7909677B2Mar 22, 2011
Method of transferring a wafer
UNITED MICROELECTRONICS CORP1 citations46
US7731572B2Jun 8, 2010
CMP head
UNITED MICROELECTRONICS CORP1 citations45
US7482244B2Jan 27, 2009
Method of preventing a peeling issue of a high stressed thin film
UNITED MICROELECTRONICS CORP0 citations45
US7732009B2Jun 8, 2010
Method of cleaning reaction chamber, method of forming protection film and protection wafer
UNITED MICROELECTRONICS CORP0 citations40
US7967960B2Jun 28, 2011
Fluid-confining apparatus
UNITED MICROELECTRONICS CORP0 citations39
SHIH HUI-SHEN
8 patentsUS8134192B2Mar 13, 2012
Integrated structure of MEMS device and CMOS image sensor device
SHIH HUI-SHEN3 citations62
US8101987B2Jan 24, 2012
Semiconductor device and method of fabricating the same
SHIH HUI-SHEN2 citations62
US8071412B2Dec 6, 2011
Method of fabricating micro-electromechanical system microphone structure
SHIH HUI-SHEN3 citations62
US8072036B2Dec 6, 2011
Micro-electromechanical system microphone structure
SHIH HUI-SHEN3 citations62
US8134215B2Mar 13, 2012
MEMS diaphragm
SHIH HUI-SHEN3 citations60
US8674463B2Mar 18, 2014
Multifunction MEMS element and integrated method for making MOS and multifunction MEMS
SHIH HUI-SHEN0 citations51
US8492857B2Jul 23, 2013
MEMS diaphragm
SHIH HUI-SHEN0 citations49
US8390085B2Mar 5, 2013
MEMS diaphragm
SHIH HUI-SHEN0 citations49