Inventor

KATSURAYAMA SATORU

JP11 patents

⚠️ This page may combine multiple inventors who share the name “KATSURAYAMA SATORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUMITOMO BAKELITE CO

3 patents

US7829992B2Nov 9, 2010

Semiconductor device and method for manufacturing semiconductor device

SUMITOMO BAKELITE CO30 citations91

US8039305B2Oct 18, 2011

Method for bonding semiconductor wafers and method for manufacturing semiconductor device

SUMITOMO BAKELITE CO5 citations55

US7838984B2Nov 23, 2010

Adhesive tape, connected structure and semiconductor package

SUMITOMO BAKELITE CO1 citations50

KATSURAYAMA SATORU

3 patents

US8319350B2Nov 27, 2012

Adhesive tape and semiconductor device using the same

KATSURAYAMA SATORU9 citations81

US8629564B2Jan 14, 2014

Semiconductor electronic component and semiconductor device using the same

KATSURAYAMA SATORU4 citations70

US8169090B2May 1, 2012

Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same

KATSURAYAMA SATORU3 citations54

IBM

1 patent

US8008122B1Aug 30, 2011

Pressurized underfill cure

IBM13 citations84

INDYK RICHARD F

1 patent

US8652941B2Feb 18, 2014

Wafer dicing employing edge region underfill removal

INDYK RICHARD F10 citations77

KOMIYATANI TOSHIO

1 patent

US8597785B2Dec 3, 2013

Adhesive film

KOMIYATANI TOSHIO7 citations76

MAEJIMA KENZOU

1 patent

US8531028B2Sep 10, 2013

Method for manufacturing electronic component, and electronic component

MAEJIMA KENZOU1 citations42

SUGINO MITSUO

1 patent

US8704378B2Apr 22, 2014

Semiconductor device

SUGINO MITSUO0 citations38