Inventor

OBORNY JAMES L

US4 patents

⚠️ This page may combine multiple inventors who share the name “OBORNY JAMES L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TEXAS INSTRUMENTS INC

3 patents

US8344749B2Jan 1, 2013

Through carrier dual side loop-back testing of TSV die after die attach to substrate

TEXAS INSTRUMENTS INC23 citations88

US6943573B1Sep 13, 2005

System and method for site-to-site yield comparison while testing integrated circuit dies

TEXAS INSTRUMENTS INC5 citations57

US10962571B2Mar 30, 2021

Interposers having cuts through an insulating substrate

TEXAS INSTRUMENTS INC0 citations43

STILLMAN DANIEL JOSEPH

1 patent

US8471577B2Jun 25, 2013

Lateral coupling enabled topside only dual-side testing of TSV die attached to package substrate

STILLMAN DANIEL JOSEPH8 citations75