Inventor
SHU CHIA-PAO
TW13 patents
⚠️ This page may combine multiple inventors who share the name “SHU CHIA-PAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
7 patentsUS9266714B2Feb 23, 2016
Micro-electro mechanical system (MEMS) structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG6 citations83
US8921145B2Dec 30, 2014
Hybrid MEMS bump design to prevent in-process and in-use stiction
TAIWAN SEMICONDUCTOR MFG11 citations75
US9355896B2May 31, 2016
Package systems
TAIWAN SEMICONDUCTOR MFG2 citations63
US9112001B2Aug 18, 2015
Package systems and manufacturing methods thereof
TAIWAN SEMICONDUCTOR MFG1 citations63
US8633554B2Jan 21, 2014
MEMS device etch stop
TAIWAN SEMICONDUCTOR MFG3 citations62
US8368152B2Feb 5, 2013
MEMS device etch stop
TAIWAN SEMICONDUCTOR MFG4 citations62
US8629516B2Jan 14, 2014
Bulk silicon moving member with dimple
TAIWAN SEMICONDUCTOR MFG0 citations51
SHU CHIA-PAO
6 patentsUS8716852B2May 6, 2014
Micro-electro mechanical systems (MEMS) having outgasing prevention structures and methods of forming the same
SHU CHIA-PAO26 citations91
US9365416B2Jun 14, 2016
Structure and method for motion sensor
SHU CHIA-PAO12 citations83
US8723280B2May 13, 2014
Hybrid MEMS bump design to prevent in-process and in-use stiction
SHU CHIA-PAO2 citations62
US8674495B2Mar 18, 2014
Package systems having a eutectic bonding material and manufacturing methods thereof
SHU CHIA-PAO2 citations62
US8338207B2Dec 25, 2012
Bulk silicon moving member with dimple
SHU CHIA-PAO4 citations61
US9000578B2Apr 7, 2015
Package systems having an opening in a substrate thereof and manufacturing methods thereof
SHU CHIA-PAO0 citations51