Inventor
LIM SO-YOUNG
KR15 patents
⚠️ This page may combine multiple inventors who share the name “LIM SO-YOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
11 patentsUS9869717B2Jan 16, 2018
Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring substrate for a tape packaging having the same
SAMSUNG ELECTRONICS CO LTD6 citations81
US8384407B2Feb 26, 2013
Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring subtrate for a tape package having the same
SAMSUNG ELECTRONICS CO LTD8 citations79
US10699974B2Jun 30, 2020
Film for package substrate, semiconductor package, display device, and methods of fabricating the film, the semiconductor package, the display device
SAMSUNG ELECTRONICS CO LTD3 citations72
US9280182B2Mar 8, 2016
Chip on film package and display device including the same
SAMSUNG ELECTRONICS CO LTD5 citations71
US9059162B2Jun 16, 2015
Chip on film (COF) substrate, COF package and display device including the same
SAMSUNG ELECTRONICS CO LTD5 citations71
US9437526B2Sep 6, 2016
Chip on film package including distributed via plugs
SAMSUNG ELECTRONICS CO LTD4 citations70
US10903127B2Jan 26, 2021
Film for a package substrate
SAMSUNG ELECTRONICS CO LTD0 citations62
US7936232B2May 3, 2011
Substrate for semiconductor package
SAMSUNG ELECTRONICS CO LTD5 citations62
US11586079B2Feb 21, 2023
Film type package comprising a plurality of test lines and a plurality of first and second connection pads and display apparatus having the same
SAMSUNG ELECTRONICS CO LTD0 citations57
US11231626B2Jan 25, 2022
Film type package comprising a plurality of test pads disposed on a plurality of margin areas and separated from a plurality of first connection pads by a cut line
SAMSUNG ELECTRONICS CO LTD0 citations57
US7760044B2Jul 20, 2010
Substrate for semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51