Inventor
YANG KYOUNG-SUK
KR4 patents
Patents
4 patentsUS9280182B2Mar 8, 2016
Chip on film package and display device including the same
SAMSUNG ELECTRONICS CO LTD5 citations71
US9059162B2Jun 16, 2015
Chip on film (COF) substrate, COF package and display device including the same
SAMSUNG ELECTRONICS CO LTD5 citations71
US9437526B2Sep 6, 2016
Chip on film package including distributed via plugs
SAMSUNG ELECTRONICS CO LTD4 citations70
US10256174B2Apr 9, 2019
Film type semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49