P

Inventor

LEE PA-LAN

KR4 patents
⚠️ This page may combine multiple inventors who share the name “LEE PA-LAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

3 patents
US9280182B2Mar 8, 2016

Chip on film package and display device including the same

SAMSUNG ELECTRONICS CO LTD5 citations71
US9059162B2Jun 16, 2015

Chip on film (COF) substrate, COF package and display device including the same

SAMSUNG ELECTRONICS CO LTD5 citations71
US9437526B2Sep 6, 2016

Chip on film package including distributed via plugs

SAMSUNG ELECTRONICS CO LTD4 citations70

KIM DONG-HAN

1 patent
US8436462B2May 7, 2013

Semiconductor housing package, semiconductor package structure including the semiconductor housing package, and processor-based system including the semiconductor package structure

KIM DONG-HAN9 citations82