P

Inventor

BROOKS J MICHAEL

US23 patents
⚠️ This page may combine multiple inventors who share the name “BROOKS J MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

20 patents
US7910385B2Mar 22, 2011

Method of fabricating microelectronic devices

MICRON TECHNOLOGY INC54 citations98
US9362208B2Jun 7, 2016

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

MICRON TECHNOLOGY INC19 citations92
US7655500B2Feb 2, 2010

Packaged microelectronic devices and methods for packaging microelectronic devices

MICRON TECHNOLOGY INC14 citations92
US7759785B2Jul 20, 2010

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

MICRON TECHNOLOGY INC10 citations84
US7750449B2Jul 6, 2010

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

MICRON TECHNOLOGY INC8 citations84
US7329949B2Feb 12, 2008

Packaged microelectronic devices and methods for packaging microelectronic devices

MICRON TECHNOLOGY INC9 citations84
US7550847B2Jun 23, 2009

Packaged microelectronic devices and methods for packaging microelectronic devices

MICRON TECHNOLOGY INC7 citations74
US6535393B2Mar 18, 2003

Electrical device allowing for increased device densities

MICRON TECHNOLOGY INC8 citations74
US9960094B2May 1, 2018

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

MICRON TECHNOLOGY INC2 citations73
US7955898B2Jun 7, 2011

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

MICRON TECHNOLOGY INC2 citations63
US7253025B2Aug 7, 2007

Multiple substrate microelectronic devices and methods of manufacture

MICRON TECHNOLOGY INC4 citations63
US6914198B2Jul 5, 2005

Electrical device allowing for increased device densities

MICRON TECHNOLOGY INC1 citations63
US6909055B2Jun 21, 2005

Electrical device allowing for increased device densities

MICRON TECHNOLOGY INC1 citations63
US10763185B2Sep 1, 2020

Packaged semiconductor components having substantially rigid support members

MICRON TECHNOLOGY INC0 citations52
US10692827B2Jun 23, 2020

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

MICRON TECHNOLOGY INC0 citations52
US10312173B2Jun 4, 2019

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

MICRON TECHNOLOGY INC0 citations52
US10163826B2Dec 25, 2018

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

MICRON TECHNOLOGY INC0 citations52
US9812415B2Nov 7, 2017

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

MICRON TECHNOLOGY INC0 citations52
US7298031B1Nov 20, 2007

Multiple substrate microelectronic devices and methods of manufacture

MICRON TECHNOLOGY INC0 citations52
US7084351B2Aug 1, 2006

Electrical device allowing for increased device densities

MICRON TECHNOLOGY INC0 citations52

CORISIS DAVID J

1 patent

KWEON YOUNG DO

1 patent

SCHWAB MATT E

1 patent