P

Inventor

LEI JIPU

US12 patents
⚠️ This page may combine multiple inventors who share the name “LEI JIPU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KONINKLIJKE PHILIPS NV

6 patents
US10020431B2Jul 10, 2018

Sealed semiconductor light emitting device

KONINKLIJKE PHILIPS NV1 citations51
US9722137B2Aug 1, 2017

LED having vertical contacts redistributed for flip chip mounting

KONINKLIJKE PHILIPS NV0 citations51
US9722161B2Aug 1, 2017

P-n separation metal fill for flip chip LEDs

KONINKLIJKE PHILIPS NV0 citations51
US9484513B2Nov 1, 2016

Semiconductor light emitting device with thick metal layers

KONINKLIJKE PHILIPS NV0 citations51
US9406857B2Aug 2, 2016

Chip scale light emitting device with metal pillars in a molding compound formed at wafer level

KONINKLIJKE PHILIPS NV1 citations50
US9608016B2Mar 28, 2017

Method of separating a wafer of semiconductor devices

KONINKLIJKE PHILIPS NV0 citations41

LEI JIPU

2 patents
US9246061B2Jan 26, 2016

LED having vertical contacts redistruted for flip chip mounting

LEI JIPU6 citations78
US9219209B2Dec 22, 2015

P-N separation metal fill for flip chip LEDs

LEI JIPU2 citations56

LUMILEDS LLC

2 patents
US10170675B2Jan 1, 2019

P—N separation metal fill for flip chip LEDs

LUMILEDS LLC0 citations51
US9935069B2Apr 3, 2018

Reducing solder pad topology differences by planarization

LUMILEDS LLC0 citations39

UNIV NORTH TEXAS

1 patent
US7534967B2May 19, 2009

Conductor structures including penetrable materials

UNIV NORTH TEXAS4 citations55

KONINKL PHILIPS NV

1 patent
US9324927B2Apr 26, 2016

Semiconductor light emitting device with thick metal layers

KONINKL PHILIPS NV1 citations51