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Inventor

NICKEL ALEXANDER H

US21 patents
⚠️ This page may combine multiple inventors who share the name “NICKEL ALEXANDER H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED MICRO DEVICES INC

8 patents
US6515368B1Feb 4, 2003

Semiconductor device with copper-filled via includes a copper-zinc/alloy film for reduced electromigration of copper

ADVANCED MICRO DEVICES INC130 citations99
US6717236B1Apr 6, 2004

Method of reducing electromigration by forming an electroplated copper-zinc interconnect and a semiconductor device thereby formed

ADVANCED MICRO DEVICES INC22 citations92
US6660633B1Dec 9, 2003

Method of reducing electromigration in a copper line by electroplating an interim copper-zinc alloy thin film on a copper surface and a semiconductor device thereby formed

ADVANCED MICRO DEVICES INC36 citations92
US6624075B1Sep 23, 2003

Method of reducing electromigration in a copper line by Zinc-Doping of a copper surface from an electroplated copper-zinc alloy thin film and a semiconductor device thereby formed

ADVANCED MICRO DEVICES INC46 citations92
US6936925B1Aug 30, 2005

Semiconductor device having copper lines with reduced electromigration using an electroplated interim copper-zinc alloy film on a copper surface

ADVANCED MICRO DEVICES INC15 citations84
US6479879B1Nov 12, 2002

Low defect organic BARC coating in a semiconductor structure

ADVANCED MICRO DEVICES INC17 citations83
US6528424B1Mar 4, 2003

Method of electroplating a copper-zinc alloy thin film on a copper surface using a chemical solution

ADVANCED MICRO DEVICES INC5 citations63
US6811671B1Nov 2, 2004

Method of controlling zinc-doping in a copper-zinc alloy thin film electroplated on a copper surface and a semiconductor device thereby formed

ADVANCED MICRO DEVICES INC3 citations62

KONINKLIJKE PHILIPS NV

5 patents

TRAN MINH Q

2 patents

LUMILEDS LLC

2 patents

LEI JIPU

1 patent

CYPRESS SEMICONDUCTOR CORP

1 patent

KONINKL PHILIPS NV

1 patent

NICKEL ALEXANDER H

1 patent