Inventor
NICKEL ALEXANDER H
US21 patents
⚠️ This page may combine multiple inventors who share the name “NICKEL ALEXANDER H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
8 patentsUS6515368B1Feb 4, 2003
Semiconductor device with copper-filled via includes a copper-zinc/alloy film for reduced electromigration of copper
ADVANCED MICRO DEVICES INC130 citations99
US6717236B1Apr 6, 2004
Method of reducing electromigration by forming an electroplated copper-zinc interconnect and a semiconductor device thereby formed
ADVANCED MICRO DEVICES INC22 citations92
US6660633B1Dec 9, 2003
Method of reducing electromigration in a copper line by electroplating an interim copper-zinc alloy thin film on a copper surface and a semiconductor device thereby formed
ADVANCED MICRO DEVICES INC36 citations92
US6624075B1Sep 23, 2003
Method of reducing electromigration in a copper line by Zinc-Doping of a copper surface from an electroplated copper-zinc alloy thin film and a semiconductor device thereby formed
ADVANCED MICRO DEVICES INC46 citations92
US6936925B1Aug 30, 2005
Semiconductor device having copper lines with reduced electromigration using an electroplated interim copper-zinc alloy film on a copper surface
ADVANCED MICRO DEVICES INC15 citations84
US6479879B1Nov 12, 2002
Low defect organic BARC coating in a semiconductor structure
ADVANCED MICRO DEVICES INC17 citations83
US6528424B1Mar 4, 2003
Method of electroplating a copper-zinc alloy thin film on a copper surface using a chemical solution
ADVANCED MICRO DEVICES INC5 citations63
US6811671B1Nov 2, 2004
Method of controlling zinc-doping in a copper-zinc alloy thin film electroplated on a copper surface and a semiconductor device thereby formed
ADVANCED MICRO DEVICES INC3 citations62
KONINKLIJKE PHILIPS NV
5 patentsUS10020431B2Jul 10, 2018
Sealed semiconductor light emitting device
KONINKLIJKE PHILIPS NV1 citations51
US9722161B2Aug 1, 2017
P-n separation metal fill for flip chip LEDs
KONINKLIJKE PHILIPS NV0 citations51
US9484513B2Nov 1, 2016
Semiconductor light emitting device with thick metal layers
KONINKLIJKE PHILIPS NV0 citations51
US9406857B2Aug 2, 2016
Chip scale light emitting device with metal pillars in a molding compound formed at wafer level
KONINKLIJKE PHILIPS NV1 citations50
US9608016B2Mar 28, 2017
Method of separating a wafer of semiconductor devices
KONINKLIJKE PHILIPS NV0 citations41