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Inventor

STEIGERWALD DANIEL ALEXANDER

US12 patents
⚠️ This page may combine multiple inventors who share the name “STEIGERWALD DANIEL ALEXANDER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KONINKLIJKE PHILIPS NV

4 patents
US9722161B2Aug 1, 2017

P-n separation metal fill for flip chip LEDs

KONINKLIJKE PHILIPS NV0 citations51
US9722137B2Aug 1, 2017

LED having vertical contacts redistributed for flip chip mounting

KONINKLIJKE PHILIPS NV0 citations51
US9705047B2Jul 11, 2017

Method of attaching a light emitting device to a support substrate

KONINKLIJKE PHILIPS NV0 citations51
US9431581B2Aug 30, 2016

Method of attaching a light emitting device to a support substrate

KONINKLIJKE PHILIPS NV0 citations51

LUMILEDS LIGHTING LLC

3 patents
US6547249B2Apr 15, 2003

Monolithic series/parallel led arrays formed on highly resistive substrates

LUMILEDS LIGHTING LLC428 citations98
US6630689B2Oct 7, 2003

Semiconductor LED flip-chip with high reflectivity dielectric coating on the mesa

LUMILEDS LIGHTING LLC93 citations97
US6455878B1Sep 24, 2002

Semiconductor LED flip-chip having low refractive index underfill

LUMILEDS LIGHTING LLC161 citations95

STEIGERWALD DANIEL ALEXANDER

2 patents
US9153758B2Oct 6, 2015

Method of attaching a light emitting device to a support substrate

STEIGERWALD DANIEL ALEXANDER4 citations65
US8951817B2Feb 10, 2015

Light emitting device chip scale package

STEIGERWALD DANIEL ALEXANDER2 citations59

LEI JIPU

1 patent
US9219209B2Dec 22, 2015

P-N separation metal fill for flip chip LEDs

LEI JIPU2 citations56

LUMILEDS LLC

1 patent
US10170675B2Jan 1, 2019

P—N separation metal fill for flip chip LEDs

LUMILEDS LLC0 citations51

BHAT JEROME CHANDRA

1 patent
US10056531B2Aug 21, 2018

Method of processing a semiconductor structure

BHAT JEROME CHANDRA0 citations43