Inventor

CHIANG JING-HUA

TW2 patents

⚠️ This page may combine multiple inventors who share the name “CHIANG JING-HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WINBOND ELECTRONICS CORP

1 patent

US5883002AMar 16, 1999

Method of forming contact profile by improving TEOS/BPSG selectivity for manufacturing a semiconductor device

WINBOND ELECTRONICS CORP17 citations79

VANGUARD INT SEMICONDUCT CORP

1 patent

US10818606B1Oct 27, 2020

Alignment mark patterns and wafer structures comprising the same

VANGUARD INT SEMICONDUCT CORP0 citations28