Inventor

DELACRUZ JAVIER

US28 patents

⚠️ This page may combine multiple inventors who share the name “DELACRUZ JAVIER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DELACRUZ JAVIER

XCELSIS CORP

Stacked IC structure with system level wiring on multiple sides of the IC die

3D chip with shared clock distribution network

Three dimensional chip structure implementing machine trained network

3D compute circuit with high density Z-axis interconnects

3D Compute circuit with high density z-axis interconnects

3D chip sharing power circuit

3D processor

Time borrowing between layers of a three dimensional chip stack

3D chip sharing data bus circuit

3D chip sharing data bus

3D chip sharing power interconnect layer

3D chip with shielded clock lines

3D chip sharing clock interconnect layer

Stacked IC structure with system level wiring on multiple sides of the IC die

Face-to-face mounted IC dies with orthogonal top interconnect layers

3D processor having stacked integrated circuit die

3D chip sharing power interconnect layer

Time borrowing between layers of a three dimensional chip stack

Face-to-face mounted IC dies with orthogonal top interconnect layers

ESILICON CORP

Elongated pad structure

Testing of thru-silicon vias

Wireless probes

Communication interface architecture using serializer/deserializer

Parallel signal via structure

Mixed-sized pillars that are probeable and routable

ADEIA SEMICONDUCTOR INC

3D chip with shared clock distribution network

3D processor having stacked integrated circuit die

INVENSAS BONDING TECH INC

Interface structures and methods for forming same