Inventor
XU QINQIN
CN12 patents
⚠️ This page may combine multiple inventors who share the name “XU QINQIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
BEIJING SENSETIME TECH DEVELOPMENT CO LTD
9 patentsUS11037348B2Jun 15, 2021
Method and apparatus for displaying business object in video image and electronic device
BEIJING SENSETIME TECH DEVELOPMENT CO LTD15 citations84
US11288796B2Mar 29, 2022
Image processing method, terminal device, and computer storage medium
BEIJING SENSETIME TECH DEVELOPMENT CO LTD2 citations73
US11640683B2May 2, 2023
Stroke special effect program file package generating method and apparatus, and stroke special effect generating method and apparatus
BEIJING SENSETIME TECH DEVELOPMENT CO LTD2 citations68
US11521389B2Dec 6, 2022
Method for generating special effect program file package, method for generating special effect, electronic device, and storage medium
BEIJING SENSETIME TECH DEVELOPMENT CO LTD2 citations68
US11368746B2Jun 21, 2022
Method and device for generating special effect program file package, method and device for generating special effect, and electronic device
BEIJING SENSETIME TECH DEVELOPMENT CO LTD2 citations68
US11461870B2Oct 4, 2022
Image processing method and device, and electronic device
BEIJING SENSETIME TECH DEVELOPMENT CO LTD1 citations60
US11687209B2Jun 27, 2023
Display method and apparatus for displaying display effects
BEIJING SENSETIME TECH DEVELOPMENT CO LTD0 citations51
US11113560B2Sep 7, 2021
Body contour key point detection methods, apparatuses, and devices
BEIJING SENSETIME TECH DEVELOPMENT CO LTD0 citations51
US11270408B2Mar 8, 2022
Method and apparatus for generating special deformation effect program file package, and method and apparatus for generating special deformation effects
BEIJING SENSETIME TECH DEVELOPMENT CO LTD0 citations45
CHINA WAFER LEVEL CSP LTD
3 patentsUS7781250B2Aug 24, 2010
Wafer level chip size package for MEMS devices and method for fabricating the same
CHINA WAFER LEVEL CSP LTD27 citations91
US7663213B2Feb 16, 2010
Wafer level chip size packaged chip device with a double-layer lead structure and method of fabricating the same
CHINA WAFER LEVEL CSP LTD20 citations90
US7394152B2Jul 1, 2008
Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same
CHINA WAFER LEVEL CSP LTD47 citations90