Inventor

SUN SEY-PING

TW75 patents

⚠️ This page may combine multiple inventors who share the name “SUN SEY-PING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUN SEY-PING

ADVANCED MICRO DEVICES INC

Semiconductor device based on Si-Ge with high stress liner for enhanced channel carrier mobility

Method of making an ultra thin silicon nitride film

Semiconductor device with self-aligned metal-containing gate

Method and apparatus for reducing wafer to wafer deposition variation

In-situ nitride/oxynitride processing with reduced deposition surface pattern sensitivity

Method for forming an integrated circuit memory cell and product thereof

Ultrathin deposited gate dielectric formation using low-power, low-pressure PECVD for improved semiconductor device performance

Ultra-thin gate oxide formation using an N2O plasma

Transistor sidewall spacers composed of silicon nitride CVD deposited from a high density plasma source

Method of manufacturing an isolation region in a semiconductor device using a flowable oxide-generating material

Method of fabricating conductor structures with metal comb bridging avoidance

Using a superlattice to determine the temperature of a semiconductor fabrication process

In-situ stack for high volume production of isolation regions

In-situ SiON deposition/bake/TEOS deposition process for reduction of defects in interlevel dielectric for integrated circuit interconnects

Method for detecting silicide encroachment of a gate electrode in a semiconductor arrangement

Self-aligning silicon oxynitride stack for improved isolation structure

Method of forming silicon nitride films

Semiconductor device with a graded passivation layer

In-situ deposition of stop layer and dielectric layer during formation of local interconnects

Method of forming silicon oxynitride films

TAIWAN SEMICONDUCTOR MFG CO LTD

Wrap-around contact

Semiconductor devices, FinFET devices, and manufacturing methods thereof

Wrap-around contact on FinFET

Semiconductor packages having dummy connectors and methods of forming same

Semiconductor packages having dummy connectors and methods of forming same

Wrap-around contact on FinFET

Wrap-around contact on FinFET

Contact structure of semiconductor device

Chemical mechanical polishing method using slurry composition containing N-oxide compound

Semiconductor packages having dummy connectors and methods of forming same

Fin structure of FinFET

FinFETs with nitride liners and methods of forming the same

Method of forming the gate electrode of field effect transistor

Non-planar transistors and methods of fabrication thereof

Method for removing hard mask oxide and making gate structure of semiconductor devices

Integrated circuit package and method

Semiconductor devices, FinFET devices, and manufacturing methods thereof

Fin structure of FinFET

TAIWAN SEMICONDUCTOR MFG

Contact structure of semiconductor device

Fin structure of FinFET

Contact structure of semiconductor device

Self-aligned dual-metal silicide and germanide formation

Contact structure of semiconductor device

Self aligned contact formation

SUN SEY-PING

Semiconductor device having elevated structure and method of manufacturing the same

CHEN NENG-KUO

Gate electrode of field effect transistor

TUNG CHIH-HANG

Non-planar transistors and methods of fabrication thereof

PAN JAMES N

Strain enhanced semiconductor devices and methods for their fabrication

CHANG CHUN-WEI

Method of protecting an interlayer dielectric layer and structure formed thereby

ADVANCED MICRODEVICES INC

Method of manufacturing a semiconductor device using advanced contact formation