Inventor

ZHAO JIE-HUA

US20 patents

⚠️ This page may combine multiple inventors who share the name “ZHAO JIE-HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZHAO JIE-HUA

APPLE INC

Systems and methods for implementing a scalable system

Systems and methods for implementing a scalable system

PoP structure with electrically insulating material between packages

Wearable electronic device with fluid-based pressure sensing

Method of lower profile MEMS package with stress isolations

Systems and methods for implementing a scalable system

Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring

Microelectronic package RDL patterns to reduce stress in RDLs across components

Recessed lid and ring designs and lid local peripheral reinforcement designs

Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring

Method of lower profile MEMS package with stress isolations

PoP structure with electrically insulating material between packages

Methodology to achieve zero warpage for IC package

FREESCALE SEMICONDUCTOR INC

Circuit device with at least partial packaging, exposed active surface and a voltage reference plane

Circuit device with at least partial packaging and method for forming

Circuit device with at least partial packaging and method for forming

Mechanical integrity evaluation of low-k devices with bump shear

Integrated circuit having structural support for a flip-chip interconnect pad and method therefor

Method of forming crack arrest features in embedded device build-up package and package thereof

LEAL GEORGE R

Circuit device with at least partial packaging and method for forming